Samsung 2014 Annual Report Download - page 26

Download and view the complete annual report

Please find page 26 of the 2014 Samsung annual report below. You can navigate through the pages in the report by either clicking on the pages listed below, or by using the keyword search tool below to find specific information within the annual report.

Page out of 114

  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • 10
  • 11
  • 12
  • 13
  • 14
  • 15
  • 16
  • 17
  • 18
  • 19
  • 20
  • 21
  • 22
  • 23
  • 24
  • 25
  • 26
  • 27
  • 28
  • 29
  • 30
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44
  • 45
  • 46
  • 47
  • 48
  • 49
  • 50
  • 51
  • 52
  • 53
  • 54
  • 55
  • 56
  • 57
  • 58
  • 59
  • 60
  • 61
  • 62
  • 63
  • 64
  • 65
  • 66
  • 67
  • 68
  • 69
  • 70
  • 71
  • 72
  • 73
  • 74
  • 75
  • 76
  • 77
  • 78
  • 79
  • 80
  • 81
  • 82
  • 83
  • 84
  • 85
  • 86
  • 87
  • 88
  • 89
  • 90
  • 91
  • 92
  • 93
  • 94
  • 95
  • 96
  • 97
  • 98
  • 99
  • 100
  • 101
  • 102
  • 103
  • 104
  • 105
  • 106
  • 107
  • 108
  • 109
  • 110
  • 111
  • 112
  • 113
  • 114

System LSI
Business
Spearheading growth in the system semiconductor market with cutting-edge logic process technology and advanced development of
next-generation products
With cutting-edge competitiveness in logic process technology and
advanced development of next-generation products, Samsung Elec-
tronics has achieved leadership in the global system LSI market. By
focusing on the key segments of SoC, LSI and the foundry business, we
are consistently enhancing our leading position in the global market to
provide competitive products, including mobile application processors
(AP), CMOS image sensors (CIS), display driver ICs (DDI) and near field
communication (NFC) ICs as well as state-of-the-art foundry services.
In 2014, we launched the 16 megapixel (MP) mobile image sensor
based on ISOCELL technology along with the industry’s first APS-C CIS
for digital cameras using 65-nanometer (nm) back side illuminated (BSI)
pixel technology. We also focused on the advanced development of
next-generation products such as the industry’s first flexible mobile DDI
using 2-metal chip on film (COF) package technology.
In 2015, we expect continuous growth in the global system LSI market
with a focus on mobile products. Early this year, we were able to secure
leadership in advanced process technology by launching 64-bit mobile
APs based on 14nm FinFET. Looking ahead, we will further strengthen
our leading position with cutting-edge process technologies beyond
14nm FinFET. In addition, we will bolster our competitiveness in mo-
bile AP products and focus on providing high-value products, such as
high-resolution ISOCELL CIS for enhanced picture quality. In the foundry
business, we will boost our competitive edge by developing state-of-the-
art logic process technology and diversifying our customer base.
16MP Mobile Image Sensor
Mobile image sensor based on
ISOCELL technology that provides
high-quality color representation and
supports QHD resolution at 30 frames
per second (fps).
Flexible Mobile DDI
Mobile DDI fabricated with the
industry’s first 2-metal COF package
technology, enabling flexible display
and ultra-high-quality QHD resolution.
Business Overview Device Solutions