Samsung 2014 Annual Report Download - page 25

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023022
2014 Samsung Electronics Annual Report
64GB 3D Through Silicon Via
(TSV) RDIMM
High-speed, high-density and
engery-efficent memory that
introduced a new era in DRAM
technology.
Top Global DRAM
Market Share in 2014
Source: IHS iSuppli,
based on 2014 sales
Top Global NAND
Flash Market Share in 2014
Source: IHS iSuppli,
based on 2014 sales
40.4 %
36.5 %