Samsung 2014 Annual Report Download - page 24

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Memory
Business
Leading the innovation for faster, thinner and smaller next-generation IT devices with high-density 3D memory technology
In 2014, Samsung Electronics took its technological leadership in memo-
ry solutions to the next level with 3D “through silicon via” (TSV) package
technology which further pushes the limits in memory chip manufac-
turing. By applying the vertically interconnected TSV technology, we
launched mass production of the 64GB 3D TSV registered dual inline
memory modules (RDIMM) for enterprise servers. The new high-speed,
highly energy-efficient and high-density module is recognized as an op-
timized solution for the era of Big Data and cloud computing. In addition,
our development of the industry’s first 32-layer V-NAND flash memory
and mass-production of next-generation Non-Volatile Memory Express
(NVMe) SSD allowed us to secure a strong foothold in the premium
memory market.
We were also the first in the industry to mass-produce 8Gb DRAM
based on our leading-edge 20-nanometer (nm) process technology. In-
cluding the new 8Gb LPDDR4 DRAM-based 4GB LPDDR4 mobile mem-
ory, Samsung now offers a comprehensive 20nm DRAM line-up for mo-
bile memory, enterprise server, PC and consumer graphics applications.
To expand our premium product line-up, we launched the high-ca-
pacity 128GB Universal Flash Storage (UFS) embedded memory for
high-end flagship smartphones as well as the 32-layer 3D V-NAND
technology-based SSD ‘850 PRO’ and portable SSD ‘T1’ to drive the
fast-growing storage memory market.
In 2015, we will expand the premium memory market with timely
introduction of high-quality products and solutions based on our tech-
nological prowess. We also plan to continue driving the trends of the
next-generation IT market as we solidify our leading position and contrib-
ute to the overall development of the IT industry.
8Gb LPDDR4 Mobile DRAM
Next-generation mobile DRAM with
doubled memory performance for
high-end smartphones.
128GB UFS
Ultra-fast embedded memory for
high-end smartphones that is up to
12 times faster than a typical
memory card.
3D V-NAND based Premium SSD ‘850
PRO’ & Portable SSD ‘T1’
SSDs with maximized performance
and world-class design, offering
enhanced user convenience.
Business Overview Device Solutions