Samsung 2008 Annual Report Download - page 37

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Our industry-leading technologies, state-of-the-art production capabilities, and close collaborative rela-
tionships with key customers have made us a global leader in memory and logic semiconductors as well
as a powerhouse in leading-edge hard drives. Despite challenging market conditions, timely advances in
production technology and an innovative, expanding product lineup have enabled us to cut costs and
expand market share while continuing to offer the most comprehensive business portfolio in the industry.
In the memory field, we extended our leadership in high-end markets by being the first to offer next-
generation DRAM products with superior power-saving characteristics. We also increased the com-
petitiveness of our product mix by expanding our lineup to include SSDs designed for server and high-
performance PC applications and more attractive “fusion” memory devices such as an improved
OneDRAM™ chip and a higher-capacity moviNAND™ chip. In the logic semiconductor field, we showed
remarkable resilience in the face of significantly weakened market demand by continuing to grow
sales revenues.
MEMORY We have held the number one position in worldwide memory sales since 1993. Today, we
continue to lead the industry in developing new technologies and manufacturing processes for DRAM,
SRAM, and flash memory products. We are also at the forefront in developing markets for high perfor-
mance products such as solid-state drives, fusion memory devices, and next-generation PRAM.
In the DRAM segment, we continue to maintain our industry leadership with the world’s smallest 50nm-
class 2Gb DRAM. We plan to strengthen our eco-friendly offerings in 2009 by commencing mass pro-
duction of a 40nm-class 2Gb DDR3 that consumes one-fourth the energy of today’s mainstay 60nm-
class products. In the NAND segment, we are leading the way in providing advanced hybrid memory
solutions for high-capacity mobile applications. We are now mass producing a 32GB moviNAND™ chip,
the industry’s first high-capacity storage solution to use 30nm-class NAND, as well as 1Gb OneDRAM™
and 40nm 8Gb Flex-OneNAND™, both double the capacity of previous offerings. In the SSD segment,
we will begin mass production of even higher-performance, higher-capacity drives in 2009, spurring the
creation of the next-generation of flash-based storage products and applications.
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24. S Series Portable External Hard Drives
By integrating a USB controller onto 1.8- and
2.5-inch hard drives, we have created a series of
external drives that are significantly smaller, lighter,
and more energy efficient than the competition with
unique data-protection features such as automatic
backup, SecretZone™ encrypted storage, and
SafetyKey™ password protection.
25. 32GB moviNAND™ eMMC Solution
The industry’s highest-density embedded storage
solution to date, this “fusion memory” chip combines
eight of our 30nm-class 32Gb NAND chips in a
multi-layer package that’s a perfect match for today’s
high-performance, multimedia-savvy mobile devices.