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R&D ACTIVITIES
Aiming to achieve sustainable growth and increase corporate value, the Hoya Group devotes
considerable effort to formulating business strategy from a long-term perspective and devel-
oping technology, as well as acquiring and cultivating new businesses. The R&D Center con-
ducts various R&D with an eye on the future. It conducts R&D in new business fields, develops
technologies and products that enhance the competitiveness of existing businesses, and
supports development on technology themes common to more than one business division.
In March 2008, Hoya merged with Pentax, in the process adding a new business domain:
Pentax’s precision devices, such as medical-use endoscopes and digital cameras, which the
company has built up over the years. In addition to Hoya’s traditional electro-optics, the
Group is investing substantial management resources in the promising medical and health-
care field, aiming to use its advanced technological capabilities to achieve sustained growth
into the future. Here we present some of the R&D themes that Hoya is currently pursuing.
Nanoimprint Technology: Verifying Molds for Next-Generation HDDs
Hoya is putting its years of expertise in lithographic technologies to good use in the develop-
ment of nanoimprint molds, which will be used to create the discrete track recording (DTR)
media for next-generation hard disk drives (HDDs). Eyeing 2010 as the date for practical appli-
cation of DTR media, HDD manufacturers are working on commercializing products, with high
hopes for using Hoya’s microfabrication technologies to achieve a track pitch of 50 nanometers.
3C-SiC: Success with Prototype Devices
Hoya is promoting the development of 3C-SiC cubic monocrystal silicon carbide semiconduc-
tor wafers and devices, which are expected to offer superior energy efficiency. 3C-SiC can be
used in automobiles and home appliances such as air conditioners to help combat global
warming. Taking volume production efficiency into account, Hoya is currently developing
six-inch wafers and testing and evaluating the power devices that will be the end product. The
Company is aiming for practical application in 2010.
Connectors for Optical Communications: Completion of Ultra-Small FTTH Components
As the FTTH (Fiber to the Home) environment widens around the world, Hoya is working to
develop a GE-PON/G-PON*1-compliant module for converting optical signals to electrical
ones at optical communication access points. GE-PON/G-PON is the next-generation stan-
dard for high-speed optical communications, and is expected to become common from 2010
and beyond. By building a functional device on top of a wafer, Hoya is aiming to create prod-
ucts that are significantly smaller than existing products.
*1 GE-PON/G-PON (Gigabyte Passive Optical Network): A technology that enables high-speed transmission of 1 giga-
byte per second over fiber optic lines and networks.
3C-SiC wafers and devices
Quartz nanoimprint mold for
DTR media
Connectors for optical communications
R&D EXPENSES
2005 2006 2007 20092008
0
5,000
10,000
15,000
20,000
25,000 5
4
3
2
1
0
(Millions of Yen) (%)
R&D ACTIVITIES/INTELLECTUAL PROPERTY ACTIVITIES
Forward Looking Research & Development
n R&D Expenses (left)
Ratio of R&D expenses to sales (right)
32 HOYA Annual Report 2009