Fujitsu 2007 Annual Report Download - page 19

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■ Main Products & Services
System Platforms: Full range of servers (mainframe,
UNIX, mission-critical IA, PC), storage systems,
various types of software (operating system,
middleware), optical transmission systems, and
mobile phone base stations
Services: Consulting, systems integration, outsourcing
services, network services, system support services,
information system installation and network con-
struction, and dedicated terminal systems and equip-
ment (ATMs, POS systems)
Left: SPARC Enterprise UNIX server Center: FLASHWAVE optical transmission system Right: Control room of
the Fujitsu Tatebayashi System Center, one of Japan’s largest IT outsourcing facilities.
PCs, mobile phones, storage equipment (hard disk
drives, magneto-optical disk drives), optical trans-
ceiver modules and other products
Left: Our FMV-DESKPOWER Series of PCs lets users enjoy digital high-definition TV programs.
Center: The FOMA® F904i was the first One Segment broadcast-compatible mobile phone to feature a full-
wide display. Right: A high-quality, high-capacity hard disk drive with excellent reliability incorporating
perpendicular magnetic recording technology.
Logic LSI devices (system LSI, ASICs*1,
microcontrollers, FRAM*2–embedded logic),
system memory devices (flash memory, FCRAM*3),
semiconductor packages, SAW*4 devices, and other
electronic components
*1 Application-Specific Integrated Circuit: A type of LSI customized for a
particular application or user requirement, as opposed to LSI circuits
for general-purpose products.
*2 Ferroelectric Random Access Memory: A nonvolatile memory charac-
terized by low power consumption, fast write times and numerous read-
write cycles. (FRAM is a trademark of Ramtron International Corporation).
*3 Fast-cycle Random Access Memory: High-speed DRAM that
incorporates our original pipeline operation technology to accelerate
memory read-write cycles.
*4 SAW devices boost the performance of mobile phones and other mobile
devices and also help to reduce size and power consumption.
Left: CPU for the SPARC Enterprise UNIX server
Right: 300mm wafer using 65nm process technology
Annual Report 2007 17