Toshiba 2011 Annual Report Download - page 28

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Yokkaichi Operations has completed construction of its Fab No.5 wafer production facility.
Production started in July 2011.
SSD for mobile notebooks
As considerable market expansion is forecast, we
are expanding our SSD line-up.
Electronic Devices Segment
Business Review
Our activities cover four key areas: memories, logic
LSIs, analog/imaging ICs and discrete
semiconductors. Business is driven by strategic
growth products: NAND flash memory (memory
business) and power devices (discrete business).
In FY2010, the semiconductor market grew
over 20% year-on-year, on expanded demand for
new mobile devices, such as smartphones and
tablet PCs, and high growth in emerging markets.
The memory business overcame a strong
yen, and notably higher net sales reflected rising
demand for mobile devices and solid state drives
(SSD), plus continued price stability in NAND flash
memories.
The logic LSI and analog/imaging IC
businesses saw lower demand and net sales due
to the strong yen and the reaction following the
end of economic stimulus packages.
In the discrete business, strong first half
demand ebbed in the second half and net sales
were slightly higher than last year.
As a result, overall sales increased in FY2010,
and this, plus benefits from advances in process
migration and cost reductions, produced a
significant increase in operating income.
The March 11 earthquake temporarily shut
down Iwate Toshiba Electronics Co., Ltd. in
northeast Japan. Production resumed on April 18.
The memory business, number two in global
market share (April 2011; Source: Toshiba), in
August 2010 led the industry in starting mass
production of NAND flash memories with
24-nanometer process technology, and in doing so
achieved the world’s smallest commercialized
64GB memory chip (August 2010; Source: Toshiba).
We started to ship embedded NAND flash
memories fabricated with the same process
technology in April 2011.
In April 2011 we pioneered application of
19nm process technology and started to ship
samples.
Anticipating increased demand for high-
density products and long-term market expansion,
we reinforced NAND flash memory capacity at
Yokkaichi Operations with a new wafer production
facility, Fab No.5. Construction finished in March 2011.
Designed with earthquake-proof structures
and maximum consideration for the environment,
Fab 5 features LED lighting, the latest energy saving
production equipment, and uses only pumps with
inverter control. The target is for 12% less CO2
emissions than from its predecessor, Fab No. 4.
Electronic Devices Segment
Semiconductor Company
26
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