AMD 2003 Annual Report Download - page 276

9.3 Research in Fab X is to take place in the areas indicated in Appendix 9.3.
§ 10 Agreement on Acceptance/AMD Fab X Cost Plus Reimbursement Agreement
10.1 AMD undertakes to take the entire production of AMD Fab X (in warmed-up operation up to [***]* Wafer outs per month).
10.2 The details of the acceptance obligation and the terms thereof arise from the AMD Fab X Cost Plus Reimbursement Agreement attached in the draft
version as Appendix 10.2.
§ 11 Service Agreements
11.1 AMD shall ensure that AMD Saxony shall make available to AMD Fab X general administrative services (for example IT, personnel administration,
administrative services of a commercial nature) if required at competitive terms (at arms’ length). In other respects AMD Fab X shall set up the required
resources itself or obtain them from third parties.
11.2 In relation to the services required by AMD Fab X from today’s perspective, AMD Fab X, AMD, AMD Fab X Holding GmbH and AMD Saxony will
enter into the Fab X Management Services Agreement which is attached hereto as Appendix 11.2. AMD will be jointly and severally liable for the
obligations of AMD Saxony under the agreement.
§ 12 Arbitrator
If and insofar as the Parties are unable to agree on the achievement of the milestones (see Appendix 4.1.1) and on the requirements stated in Section 14.1,
the Parties will make efforts to immediately agree on an arbitrator and will instruct such arbitrator in the name of all the Parties for him to determine the
disputed
* Confidential treatment has been requested pursuant to section IV.2. of the Confidential Treatment Request dated March 9, 2004.
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Source: ADVANCED MICRO DEVIC, 10-K, March 09, 2004