AMD 2003 Annual Report Download - page 15
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Table of Contents
Manufacturing, Assembly and Test Facilities
Our microprocessor fabrication and FASL LLC’s Flash memory fabrication is conducted at the facilities described in the chart below:
Facility Location
Wafer Size
(Diameter in
Inches)
Production
Technology
(in Nanometers)
Approximate
Clean Room
(Square Footage)
Computation Products
Dresden, Germany
Fab 30 8 130 150,000
Flash Memory Products
Austin, Texas
Fab 25 8 130 and 170 120,000
Aizu-Wakamatsu, Japan
JV1 8 230 and 320 70,000
JV2 8 230 91,000
JV3 8 130 and 170 118,000
We also have foundry arrangements with third parties for the production of our Personal Connectivity Solutions and chipset products.
The current assembly and test facilities for our microprocessor products are described in the chart set forth below:
Facility Location
Approximate
Facility
Square Footage Activity
Penang, Malaysia 239,000(1) Assembly & Test
Singapore 234,000(2) Test
(1) Of the total 239,000 square feet, approximately 127,000 square feet is devoted to administrative offices.
(2) Of the total 234,000 square feet, approximately 40,000 square feet is devoted to administrative and sales offices.
Some assembly and final testing of our microprocessor products is also performed by subcontractors in the United States and Asia.
The current assembly and test facilities for FASL LLC’s Spansion Flash memory products are described in the chart set forth below:
Facility Location
Approximate
Assembly & Test
Square Footage Activity
Bangkok, Thailand 78,000 Assembly & Test
Kuala Lumpur, Malaysia 71,300 Assembly & Test
Penang, Malaysia 71,000 Assembly & Test
Suzhou, China 30,250 Assembly & Test
Some assembly and final testing of FASL LLC’s products is performed by subcontractors in Asia, including Fujitsu’s final assembly and testing facility in
Kyushu, Japan.
The political and economic risks associated with operations in foreign countries include:
• expropriation;
• changes in a specific country or region’s political or economic conditions;
10
Source: ADVANCED MICRO DEVIC, 10-K, March 09, 2004