AMD 2006 Annual Report Download - page 256

EXECUTION VERSION
In-Line Specification document, if available
Reliability Documentation
Qualification plan for T0, T1 and T2
Early reliability stress results
Physical failure analysis data
eDRAM Documentation
eDRAM Design Manual Addendum
eDRAM Macro (hard core) Documentation and Design Kit, including specifications, product description, Schematics, VHDL, GDS, CDL netlist,
timing cross sections
eDRAM Pump Macro (hard core) Documentation and Design Kit, including product description, Schematics, VHDL, GDS, CDL netlist
eDRAM BIST Macro (soft core) Documentation and Design Kit, including product descriptions, Schematics, VHDL (soft core)
Memory Subsystem Test Chip Documentation
Functional Test Specifications and Test Programs
Additional requests for Documentation shall be by the mutual agreement of the Project Leaders, which agreement shall not be unreasonably withheld. If,
however, the Project Leaders do not agree, such Party may escalate the lack of agreement among the Project Leaders to the Management Committee for
resolution. In addition, such Party may access information available during the Process Development Projects and document such information for the purpose of
transferring such information to its own manufacturing facilities. All such documentation shall be made available to all three (3) Parties.
Third Amendment and Restatement of “S” Process Development Agreement between AMD and IBM
IBM - AMD Confidential Page 88 of 90
Source: ADVANCED MICRO DEVIC, 10-K, March 01, 2007