AMD 2006 Annual Report Download - page 255

EXECUTION VERSION
- Mask data processing sequence including OPC/PPC
- Method of process characterization to extract OPC/PPC data correction paramaters for the correction software
- Mask qualification procedure
- Specific mask making tool selection and its derived mask fabrication specification if exists
Bump Documentation
Process routing
Process of Record (POR)
- Process change history (after T2 process freeze)
Process assumptions, if available
Process engineering specifications
Unit process descriptions and characterization (rate, uniformity, selectivity, particle, etc.)
Process recipes for critical unit processes
Process window definition and define process limitations
Specification Sheets for critical dimensions, overlay
Cp/Cpk for critical measurements
List of critical tools including QC tools
Critical Equipment specifications
- Critical maintenance procedures
TEM Cross Sections (both center and edge)
Cross section data of bump geometries
Physical characterization results (e.g., SEM, EDX, SIMS, etc.)
Reliability measurement methodology and applicable results including fatigue and electromigration
Tool control/monitor data for critical tools
Material Specifications for critical materials
- plating baths, sputtering targets and suppliers
- Contamination effects
Defect Catalog
Bill Of Materials For bumps
Technology Qualification Vehicle Documentation
Technology Design Manual, if available
Third Amendment and Restatement of “S” Process Development Agreement between AMD and IBM
IBM - AMD Confidential Page 87 of 90
Source: ADVANCED MICRO DEVIC, 10-K, March 01, 2007