AMD 1994 Annual Report Download - page 243

purchase minimum of Section 3.2.2 will be reduced to levels determined by AMD
upon notice from AMD or this Agreement shall immediately terminate upon notice
from AMD with no further opportunity for TSMC to complete Qualification. If AMD
terminates this Agreement under this Section 2.6.3, the manufacturing
exclusivity under Section 2.2 shall continue until [CONFIDENTIAL INFORMATION
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION], and
the license to TSMC under Section 2.3 shall be suspended until [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION].
2.7 Before Qualification, TSMC and AMD will agree upon parametric and process
flow specifications which will be finalized before TSMC begins production. TSMC
will not modify agreed upon specifications or routine process control steps in
any way without the prior written consent of AMD.
2.8 TSMC agrees that it will transfer the 0.5 micron Qualified Process to the
8" wafer production line currently under construction in a timely fashion. AMD
will provide reasonable support for the transfer.
3. PRODUCTION
3.1 Using the Qualified Process, TSMC will manufacture the Products as Wafers
with tested Die.
3.2 As soon as a process becomes a Qualified Process:
3.2.1 TSMC will reserve for AMD the Reserved Production Capacity on the
Qualified Process.
3.2.1.1 The initial Reserved Production Capacity will become
firm only when the Products are released for production
and will ramp up as follows:
Month After Release Rate (Wafers/Week)
------------------- ------------------
1st [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES
AND EXCHANGE COMMISSION]
2nd [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES
AND EXCHANGE COMMISSION]
3rd [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES
AND EXCHANGE COMMISSION]
4
Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995