AMD 1994 Annual Report Download - page 240

AMD - TSMC
FOUNDRY AGREEMENT
THIS AGREEMENT (Agreement) is between Taiwan Semiconductor Manufacturing
Corporation (TSMC), a Taiwanese corporation having its principal office at No.
121, Park Avenue 3, Science Based Industrial Park, Hsin-chu, Taiwan, and
Advanced Micro Devices, Inc. (AMD), a Delaware U.S.A. corporation having its
principal office at One AMD Place, Sunnyvale, California 94088-3453.
WHEREAS, AMD has developed certain technology relating to microprocessors and
other logic;
WHEREAS, TSMC has developed manufacturing processes, capabilities and foundry
capabilities to produce silicon wafers based upon the operational criteria and
process technology provided by others; and
WHEREAS, TSMC and AMD desire to enter into this Foundry Agreement for the
manufacture by TSMC of microprocessor and other logic wafers containing AMD
technology.
IN CONSIDERATION of mutual promises in this Agreement, the parties agree as
follows:
1. DEFINITIONS
1.1 "Die" means good silicon die produced according to the Qualification
Requirements by TSMC for AMD using the Qualified Process. The Die are to be
provided to AMD as Wafers with tested die.
1.2 "Wafer" means the six inch (6") diameter and eight inch (8") diameter
wafers produced by TSMC for AMD using the Qualified Process. Where only six
inch (6") or eight inch (8") wafers are referred to, they will be respectively
specified as 6" or 8" Wafers.
1.3 "Products" means the different types of microprocessors or other logic to
be produced from Die manufactured under this Agreement as set forth in Exhibit A
(1.3) as amended from time to time by the mutual consent of the parties.
1.4 "Qualification Plan" means the steps to be taken to meet the objective
reliability and quality specifications referred to as AMD Specification 00-021
as set forth in Exhibit B (1.4, 1.7, 1.8).
1.5 "Qualification" means the determination that the Die meet the Qualification
Requirements in accordance with the Qualification Plan.
1.6 "Qualified Process" means the 0.5 micron or smaller AMD manufacturing
process which will include AMD proprietary technology including, but not limited
to, AMD's chemical mechanical polishing (CMP) process, with modifications made
with the mutual agreement of the parties. The Qualified Process may be amended
from time to time by the mutual consent of the parties.
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Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995