AMD 1994 Annual Report Download - page 233

EXHIBIT D
WAFER ACCEPTANCE CRITERIA
DIGITAL will be manufacturing sorted die for AMD. The Acceptance Criteria for
the die will be based on three criteria. The criteria will be Wafer Electrical
Test (WET), Wafer Sort Yield, and Die Visual Quality.
A. WET criteria will be based on the measurements of DIGITAL test structures
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prior to wafer sort. All test structures will reside on nine sites per wafer.
The test structure minimum, maximum, and target will be defined and agreed upon
by the parties and be incorporated by reference in this Exhibit
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION] of the wafers will be tested at WET. If a test is outside
of the minimum - maximum range, that will constitute a failure at that site. If
there are greater than [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION] failures on a wafer for the same
test, the wafer will be considered as failing the WET criteria. If the wafer is
outside the WET range due to engineering tests, it will be accepted; if it is
outside the range due to processing issues, then it will be a candidate for
scrap. The final decision on scrap will be made by the joint AMD-DIGITAL
disposition review process.
B. The Wafer Sort Criteria will initially be set such that any wafers with a
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yield of less than [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH
THE SECURITIES AND EXCHANGE COMMISSION] and any lots with an average yield of
less than [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] (for the lot size of those wafers entering
sort--accounting for fab yield and WET rejection) will be scrapped. (Changes in
die size can trigger a review of these initial scrap limits if requested by
DIGITAL). Recognizing that product reliability is heavily dependent on defect
levels, these scrap limits will be reviewed by AMD and DIGITAL on a semi-annual
basis and adjusted upward as yield improves. New limits should be set based on
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yield data from the latest six (6) months of production.
The lot-scrap limit should be set at the greater of the following (Use the
distribution of lot-yield averages for items (2) and (3)):
(1) the present lot-scrap limit,
(2) [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] -standard deviations less
than the mean, or
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Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995