AMD 1994 Annual Report Download - page 234

Exhibit D--Wafer Acceptance Criteria (continued)
(3) the lower [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION] point of the
distribution (point where [CONFIDENTIAL INFORMATION OMITTED AND
FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION] of
all lots pass).
The wafer-scrap limit should be set at the greater of the following (Use
the distribution of wafer yields for items (2) and (3) after removing scrapped
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lots from the distribution):
(1) The present wafer-scrap limit,
(2) [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION]-standard deviations less
than the mean (excluding lot scraps, or
(3) the lower [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION] point of the
distribution (excluding lot scraps), (point where [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND
EXCHANGE COMMISSION] of all wafers pass).
DIGITAL has the option to request a material review for disposition with
AMD of any scrap material.
C. Die Visual criteria will be based on AMD Product Assurance Outgoing
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Inspection specification #306-005, or as modified by mutual agreement of the
parties. DIGITAL has the option on any questionable material, that does not
meet the inspection criteria, to request a joint disposition review by AMD and
DIGITAL.
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Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995