AMD 1994 Annual Report Download - page 210

TABLE OF CONTENTS
SECTION 1 - DEFINITIONS..................................................... 1
SECTION 2 - NATURE OF THIS AGREEMENT........................................ 3
SECTION 3 - DEVELOPMENT PROCEDURE........................................... 4
SECTION 4 - DEVICE QUALIFICATION............................................ 5
SECTION 5 - PRODUCTION...................................................... 6
SECTION 6 - OWNERSHIP AND LICENSES.......................................... 8
SECTION 7 - MASK WORKS RIGHTS............................................... 9
SECTION 8 - PURCHASE ORDERS AND FORECASTS................................... 9
SECTION 9 - PAYMENT......................................................... 10
SECTION 10 - DELIVERY AND ACCEPTANCE........................................ 11
SECTION 11 - TERM AND TERMINATION........................................... 12
SECTION 12 - WARRANTY AND INDEMNITY......................................... 13
SECTION 13 - CONFIDENTIALITY................................................ 15
SECTION 14 - FORCE MAJEURE.................................................. 17
SECTION 15 - PARTIAL INVALIDITY............................................. 17
SECTION 16 - NOTICES........................................................ 17
SECTION 17 - NON-WAIVER..................................................... 18
SECTION 18 - NON-ASSIGNABILITY/TRANSFERABILITY.............................. 19
SECTION 19 - SECTION HEADINGS............................................... 19
SECTION 20 - GOVERNING LAW.................................................. 19
SECTION 21 - PUBLICITY...................................................... 19
SECTION 22 - ENTIRE AGREEMENT............................................... 19
SECTION 23 - LIMITATION OF LIABILITY........................................ 19
EXHIBIT A DEVICES AND DEVICE SPECIFICATIONS................................ 21
EXHIBIT B SECTION 1: DEVICE TRANSFER AND QUALIFICATION PLAN
SECTION 2: DEVICE TECHNOLOGY PACKAGE............................ 22
EXHIBIT C QUALIFIED PROCESS(ES) SPECIFICATION
PRODUCT QUALIFICATION SPECIFICATION.............................. 23
EXHIBIT D WAFER ACCEPTANCE CRITERIA........................................ 24
EXHIBIT E PAYMENT CALCULATION.............................................. 26
EXHIBIT F [CONFIDENTIAL INFORMATION OMITTED AND FILED
SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION]...................................................... 28
Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995