AMD 1994 Annual Report Download - page 241

1.7 "Qualification Requirements" means the criteria and specification the die
must pass to be accepted by AMD, as set forth in Exhibit B (1.4, 1.7, 1.8).
1.8 "Transfer Documentation" means the topographical design rules, parametric
specifications, and process information for the Qualified Process, as set forth
in Exhibit B (1.4, 1.7, 1.8).
1.9 "Reserved Production Capacity" means the maximum capability to produce
Wafers which TSMC will allocate to AMD and guaranteed to produce at AMD's
request as set forth in Exhibit C (1.9).
1.10 "Confidential Information" means the provisions of this Agreement and the
previously transferred and to be transferred information related to Wafer
production, Products and test under this Agreement including all exhibits, and
information including but not limited to technical information, database tapes,
specifications, test tapes, masks and supporting documentation provided either
orally, in writing, or in machine readable format and masks or reticles
generated by or for TSMC using AMD database tapes; provided that all such
information other than masks or reticles, is marked "Confidential" or similarly,
or, if oral, identified as confidential at the time of disclosure and described
in writing within thirty (30) days thereafter. Notwithstanding the foregoing,
Confidential Information does not include information generally available to the
public, information independently developed or known by the receiving party
without reference to information disclosed hereunder, information rightfully
received from a third party without confidentiality obligations, or information
authorized in writing for release by the disclosing party hereunder.
2. PROCESS TECHNOLOGY
2.1 AMD will transfer to TSMC for the Qualified Process [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION] as more fully described in the Transfer [CONFIDENTIAL INFORMATION
OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION]
2.2 TSMC agrees that it will manufacture exclusively for AMD [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION] or smaller devices which are capable of running an [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION] or [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] compatible instruction set for a period
beginning on the Effective Date and ending on [CONFIDENTIAL INFORMATION OMITTED
AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION]. This
manufacturing exclusivity, however, does not apply to any manufacturing activity
where TSMC uses its own process that does not include AMD's CMP process or any
other AMD proprietary technology.
2.3 AMD grants to TSMC a personal, nonexclusive, irrevocable, nontransferable,
right and license, without the right to grant sublicenses to third parties, to
use the Qualified Process
2
Source: ADVANCED MICRO DEVIC, 10-K, March 07, 1995