AMD 1996 Annual Report Download - page 87

DESIGN/BUILD AGREEMENT
BETWEEN
AMD SAXONY MANUFACTURING GmbH
AND
MEISSNER + WURST GmbH + CO.
PERTAINING TO
DESIGN AND CONSTRUCTION OF AMD FAB 30, DRESDEN, GERMANY
Preamble
THIS DESIGN/BUILD AGREEMENT is made and entered into as of the 15th day of
November, 1996 by and between AMD SAXONY MANUFACTURING GmbH, having its home
office at AMD European Microelectronics Center, Grossehainer Strasse 92, 01127
Dresden, Germany, hereinafter referred to as "COMPANY", and MEISSNER + WURST
GmbH + CO., having its home office at Rossbachstrasse 38, 70499 Stuttgart,
Germany, hereinafter referred to as "CONTRACTOR".
R E C I T A L S
---------------
A. COMPANY owns certain land located in the City of Dresden, State
of Saxony, Germany (the "SITE").
B. COMPANY desires to obtain new state-of-the-art wafer fabrication
and associated support facilities to be located on the Site for the design and
production of integrated circuits.
C. CONTRACTOR desires to plan, design, construct, erect, install,
equip, start up, test, calibrate, adjust and turn over the facilities in
accordance with this Agreement and the Contract Documents (defined in Section
-------
3.1 below) (this Agreement and the Contract Documents are collectively called
- ---------
the "CONTRACT").
NOW, THEREFORE, for and in consideration of the payments hereinafter
specified to be made by COMPANY, and in consideration of the promises and mutual
covenants and agreements of the parties herein contained, the parties hereto do
hereby agree as follows:
ARTICLE 1
SCOPE OF WORK
1.1 FACILITY. The improvements and equipment to be planned, designed,
--------
engineered, developed, fabricated, constructed, furnished and/or installed,
started up, tested, calibrated, adjusted and turned over under the Contract
(which improvements and equipment are herein sometimes referred to collectively
as the "FACILITY") are as follows:
The Facility known as AMD European Microelectronics Center, located in
Dresden, Germany.
The Facility shall include the buildings, structures, building systems, site
improvements, roads, utilities, wastewater disposal, sewer and other
1
Source: ADVANCED MICRO DEVIC, 10-K, March 20, 1997