Omron 2007 Annual Report Download - page 34

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In June 2007, Omron entered into a business and capi-
tal alliance with LaserFront Technologies Co., Ltd. (LFT), a
development and manufacturing company of precision laser
processing equipment that became independent of NEC Corp.
and that recorded net sales of ¥10.3 billion in fiscal 2006, and
officially changed its name to OMRON LASERFRONT Inc. (See
P21). This company is the first in the world to commercialize the
use of solid lasers and possesses technological expertise of
the highest standard in both laser oscillators and laser process
technology that utilizes the oscillators in manufacturing. The
company in particular boasts top global share for laser CVD
repair systems* for LCD panels.
Through this capital alliance, IAB added to its product line-
up various products used in manufacturing and repair process-
es such as laser repair devices, laser markers** and laser
welders which utilize precision laser processing technologies
owned by LFT. Furthermore, IAB plans to expand the domain of
its quality solution business by providing solutions for yield
improvement and traceability systems in all areas of produc-
tion processes including machining, assembly, inspection,
measuring, and repair.
*CVD repair systems for LCD displays: these systems improve the yield in
LCD mass production by using laser irradiation on defective areas occur-
ring in the metal wiring pattern on LCD substrates in processes for LCD
displays. Products are repaired through thin film pattern cuts, fusion join-
ing, and connection of spaces between wiring with laser CVD film. Laser
CVD (chemical vapor deposition) is a coating method based on the for-
mation of a membrane through chemical and physical reactions of raw
material gas on a laser irradiated surface achieved by irradiating laser
beams on a substrate placed in the gas.
**Laser markers: devices which directly engrave characters such as let-
ters and symbols on a surface by altering, fusing, or evaporating a part of
the material surface through laser irradiation. One example of such devices
is two-dimensional bar-code printing equipment.
Case 2: Total quality support at the production site through precision laser processing technologies
Following the transfer of assets of the semiconductor
business of Seiko Epson Corporation and its consolidated sub-
sidiary Yasu Semiconductor Corporation to ECB at the end of
fiscal 2006, OMRON Semiconductors Co., Ltd. (OSC) was
established as a wholly-owned subsidiary and commenced
operation in April 2007. The new company started with the
commissioned manufacturing of nonvolatile memory and logic
ICs employing an 8-inch CMOS (complementary metal oxide
semiconductor) production line. As OSC gradually expands its
production lineup to include proprietary semiconductor ele-
ments and other products, it is aiming for sales of ¥3 billion in
fiscal 2007 and more than ¥5 billion in fiscal 2010.
The Omron Group has been involved in the development,
production and marketing of custom ICs that offer functionality
and cost performance not found in general-purpose semicon-
ductors as well as MEMS (micro electro mechanical systems)*
products such as flow sensors and pressure sensors that utilize
semiconductor processes in their manufacture. The acquisi-
tion of OSC will facilitate further development of products that
utilize semiconductors within our Group as we push ahead
with plans to fully strengthen and expand our semiconductor-
related business.
*MEMS (micro electro mechanical systems) are electronic device sys-
tems consisting of minute parts fabricated using semiconductor micro-
fabrication technology where photographic technology is applied.
Specifically, the method of production involves applying photographic
sensitive material over a silicon wafer and printing an electronic circuit
pattern through irradiation and then scraping off unwanted parts of the sur-
face by etching and other methods.
Case 3: Full-fledged entry into the proprietary development and production of Omron semiconductors
Production Process
LCD repair
Film-thickness sensor, LCD /
overlay measurement
Two dimension code reader/RFIDLaser marker
Laser welding Laser trimmer
Integration Sensing & control technologiesPrecision laser processing technologies
Material Processing Assembly
Information (Traceability)
Inspection /
Measurement Repair (processing) Shipment