Fujitsu 2004 Annual Report Download - page 20

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Akiruno Technology Center
18
In order to further strengthen our Flash memory
business, we joined forces with longtime partner AMD to
establish a new company, FASL LLC (subsequently
renamed Spansion LLC), which carries out everything
from R&D to production, test & assembly and marketing.
In addition to bolstering the Flash memory business in
this way, we are continuing product sales and support
activity as a pillar of our LSI business.
In compound semiconductors, we established a joint
venture, Eudyna Devices, Inc., with Sumitomo Electric
Industries, Ltd. This operational consolidation will help
to increase our competitiveness and presence in the
microwave devices segment and other compound
semiconductor markets, while enabling us to provide
customers with the most competitively priced and
highest quality products.
Seeking to capitalize on the expanding market for PDPs,
we plan to expand monthly production capacity to
100,000 units from January 2005 and to a maximum of
250,000 units in 2007. While competition is expected to
become even more intense, we intend to prevail on the
strength of our superior technology and cost
performance, maintaining our top market share in the
industry.
Business Strategy
Building on market growth from last year, our goal in
fiscal 2004 is to increase profitability in both mainstay and
leading-edge products, with logic chips as our core
business. Fujitsu holds a leadership position in advanced
technologies, and we will place emphasis on expanding
our business with partners such as Transmeta Corporation
and Lattice Semiconductor Corporation. In addition, we
will further enhance our competitiveness as a new
Integrated Device Manufacturer able to integrate
manufacturing, sales and technology in one entity.
＊90nm CMOS process：Semiconductor material and miniaturization process
technology to realize high speed, low power consumption and
high density. A nanometer (nm) is one-billionth of a meter.
FR-V Processor MCP
Microcontroller Plasma Display Panel
During the second half of fiscal 2003 we began volume
production of advanced logic chips using our leading-
edge 90nm CMOS process*. In response to increasing
customer demand, we developed plans to build a
300mm fab at our Mie Plant, targeting start-up of volume
production from April 2005. We aim to significantly
increase profitability by implementing a new business
model that focuses on advanced products and features
close collaboration with internal and external partners at
every stage – from development to design and
production – as well as introduction of a production
system tightly linked to customer demand. At the same
time, we will move ahead with the development of
cutting-edge technologies to ensure the continued
competitiveness of our servers, network equipment and
other platform products.
Key Product Strategies
Electronic Devices
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