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101
4.15 Indenture, dated as of February 12, 2013, by and between Micron Technology, Inc. and U.S. Bank National
Association, as trustee (2)
4.16 Form of 2033E Note (included in Exhibit 4.14) (2)
4.17 Form of 2033F Note (included in Exhibit 4.15) (2)
4.18 Indenture, dated as of November 12, 2013, by and between the Company & U.S. Bank National Association
(13)
4.19 Form of New Note (included in Exhibit 4.18) (13)
4.20 Indenture dated as of December 16, 2013, by and among Micron Semiconductor Asia Pte., Ltd., Wells Fargo
Bank, National Association, and Export-Import Bank of the United States (14)
4.21 Indenture dated as of February 10, 2014, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee (15)
4.22 Form of Note (included in Exhibit 4.21) (15)
4.23 Indenture, dated as of July 28, 2014, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee (16)
4.24 Form of Note (included in Exhibit 4.23) (16)
10.1 Executive Officer Performance Incentive Plan, as Amended (17)
10.2 1994 Stock Option Plan, as Amended (17)
10.3 1994 Stock Option Plan Form of Agreement and Terms and Conditions (18)
10.4 1997 Nonstatutory Stock Option Plan, as Amended (4)
10.5 1998 Non-Employee Director Stock Incentive Plan, as Amended (17)
10.6 1998 Nonstatutory Stock Option Plan, as Amended (4)
10.7 2001 Stock Option Plan, as Amended (4)
10.8 2001 Stock Option Plan Form of Agreement (19)
10.9 2004 Equity Incentive Plan, as Amended and Restated
10.10 2004 Equity Incentive Plan Forms of Agreement and Terms and Conditions
10.11 Amended and Restated 2007 Equity Incentive Plan (20)
10.12 2007 Equity Incentive Plan Forms of Agreement (21)
10.13 Nonstatutory Stock Option Plan, as Amended (4)
10.14 Nonstatutory Stock Option Plan Form of Agreement and Terms and Conditions (18)
10.15 Lexar Media, Inc. 1996 Stock Option Plan, as Amended (17)
10.16 Lexar Media, Inc. 2000 Equity Incentive Plan, as Amended (17)
10.17 Numonyx Holdings B.V. Equity Incentive Plan (22)
10.18 Numonyx Holdings B.V. Equity Incentive Plan Forms of Agreement (22)
10.19* Patent License Agreement dated September 15, 2006, by and among Toshiba Corporation, Acclaim
Innovations, LLC and Micron Technology, Inc. (23)
10.20* Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies, LLC
dated as of February 27, 2007, between Micron Technology, Inc. and Intel Corporation (24)
10.21 Form of Indemnification Agreement between the Registrant and its officers and directors (14)
10.22 Form of Severance Agreement between the Company and its officers (25)
10.23 Form of Agreement and Amendment to Severance Agreement between the Company and its officers (26)
10.24* Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation
(27)
10.25* Product Designs Assignment Agreement dated January 6, 2006, between Intel Corporation and Micron
Technology, Inc. (27)
10.26* Supply Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash
Technologies, LLC (27)
10.27* Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC
(27)
10.28 Capped Call Confirmation (Reference No. CEODL6) by and between Micron Technology, Inc. and Morgan
Stanley & Co. International plc (10)
10.29 Capped Call Confirmation (Reference No. 53228800) by and between Micron Technology, Inc. and Credit
Suisse International (10)