Toshiba 2015 Annual Report Download - page 25

Image of advanced driver assistance system equipped with the
new image recognition processors
Structural Reform of Toshiba’s System LSI Business and Discrete Semiconductor Business
In October 2015, as a part of a fundamental restructuring, we made policy decisions in respect of structural reform of the
System LSI business and Discrete semiconductor business, part of the Semiconductor business.
In the system LSI business, we have decided to withdraw from the CMOS image sensor business, in line with a
strategy for clarifying focus businesses and reducing xed costs. In this connection, we have signed a Letter of Intent
with Sony Corporation (Sony) in respect of the transfer of assets related to the 300mm wafer production line at Oita
Operations to Sony. We have also determined to advance preparations for establishing a new company, which will
consolidate Oita Operations and Iwate Toshiba Electronics Co., Ltd. into a single business entity, to secure efficient
management of the 200mm and 150mm wafer production lines. Going forward, we will concentrate management
resources in areas where we anticipate market growth and enjoy a technological advantage, such as analog IC and
motor control drivers for automotive and other applications.
In the Discrete semiconductor business, we have decided to discontinue the White LED business and to
concentrate management resources on the power semiconductor, optical devices, and small-signal devices businesses
where we position as the main focus and anticipate market expansion.
With measures above, we will aim to record an operating surplus in FY2016 in these businesses.
New No.2 fabrication facility (rendering) at Yokkaichi Operations which is for
mass production of 3D flash memory
Semiconductor for Image Recognition Processors for Automotive Applications
Toshiba started sample shipments of new series of the
image recognition processors for automotive applications
which recognize trac lanes and vehicles, among others,
around vehicles using camera-based vision systems. This
product can identify pedestrians even at night, and detect
unexpected obstacles on a street unlike conventional
products. In recent years, demands for automobiles equipped
with advanced driver assistance system have been increasing,
and needs for automated driving are also expected to
increase in the future. Therefore, the Company will actively
develop the automotive semiconductor business which can
be expected to largely grow.
New fabrication facility at Yokkaichi Operations
Toshiba celebrated the opening of the second phase of the
No.5 semiconductor fabrication facility at Yokkaichi
Operations, Toshiba's NAND flash memory plant in Mie
Prefecture, Japan. Mass production in phase 2 began, with
15nm NAND ash memory process technology. Furthermore,
in order to secure space to install mass production
equipment exclusively for 3D ash memory "BiCS FLASHTM,"
the Company is pushing ahead with construction of the new
No. 2 fabrication facility, which is scheduled to be completed
in the rst half of 2016. The Company will rmly maintain a
market leadership by promoting development of cutting-
edge nanotechnology and "BiCS FLASHTM" to further enhance
its competitiveness.
Business Overview / Electronic Devices & Components
24
TOSHIBA Annual Report 2015