Dow Chemical 2011 Annual Report Download - page 97

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The Dow Chemical Company and Subsidiaries
PART I, Item 1. Business.
THE COMPANY
The Dow Chemical Company was incorporated in 1947 under Delaware law and is the successor to a Michigan corporation, of
the same name, organized in 1897. Except as otherwise indicated by the context, the terms “Company” or “Dow” as used
herein mean The Dow Chemical Company and its consolidated subsidiaries. On April 1, 2009, the merger of Rohm and Haas
Company (“Rohm and Haas”) with a subsidiary of the Company was completed, and Rohm and Haas became a wholly owned
subsidiary of Dow.
Dow is a diversified, worldwide manufacturer and supplier of products used primarily as raw materials in the manufacture
of customer products and services. The Company serves the following industries: appliance; automotive; agricultural; building
and construction; chemical processing; electronics; furniture; housewares; oil and gas; packaging; paints, coatings and
adhesives; personal care; pharmaceutical; processed foods; pulp and paper; textile and carpet; utilities; and water treatment.
The Company’s principal executive offices are located at 2030 Dow Center, Midland, Michigan 48674, telephone
989-636-1000. Its Internet website address is www.dow.com. All of the Company’s filings with the U.S. Securities and
Exchange Commission are available free of charge through the Investor Relations page on this website, immediately upon
filing. The Company's website and its content are not deemed incorporated by reference into this report.
BUSINESS AND PRODUCTS
Corporate Profile
Dow combines the power of science and technology to passionately innovate what is essential to human progress, connecting
chemistry and innovation with the principles of sustainability to help address many of the world's most challenging problems
such as the need for clean water, affordable housing, healthy foods and renewable energy. Dow's diversified portfolio delivers a
broad range of technology-based products and solutions to customers in approximately 160 countries and in high growth
sectors such as electronics, water, energy, coatings and agriculture. In 2011, Dow had annual sales of $60.0 billion and
employed approximately 52,000 people worldwide. The Company's more than 5,000 products are manufactured at 197 sites in
36 countries across the globe. The following descriptions of the Company's six operating segments include a representative
listing of products for each business.
ELECTRONIC AND FUNCTIONAL MATERIALS
Applications: chemical mechanical planarization chemical processing aids and intermediates electronic displays food
and pharmaceutical processing and ingredients home and personal care ingredients hygiene and infection control
photolithography printed circuit boards process and materials preservation semiconductor packaging electronic and
industrial finishing
Dow Electronic Materials is a leading global supplier of materials for chemical mechanical planarization (CMP);
materials used in the production of electronic displays, including brightness films, diffusers, metalorganic light
emitting diode (LED) precursors and organic light emitting diode (OLED) materials; products and technologies that
drive leading edge semiconductor design; materials used in the fabrication of printed circuit boards; and integrated
metallization processes critical for interconnection, corrosion resistance, metal finishing and decorative applications.
These enabling materials are found in applications such as consumer electronics, flat panel displays and
telecommunications. Dow Electronic Materials includes Display Technologies, Growth Technologies, Interconnect
Technologies and Semiconductor Technologies.
• Products: ACuPLANE™ CMP slurries; AR™ antireflective coatings; AUROLECTROLESS™ immersion gold
process; COPPER GLEAM™ acid copper plating products; CYCLOTENE™ advanced electronics resins;
MICROFILL™ EVF Copper Via Fill; ENLIGHT™ products for photovoltaic manufacturers; EPIC™ immersion
photoresists; INTERVIA™ photodielectrics for advanced packaging; OPTOGRADE™ metalorganic precursors;
SOLDERON™ BP Tin Silver for lead-free wafer bumping; VISIONPAD™ CMP pads