Casio 2000 Annual Report Download - page 16

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14
NEW JOINT VENTURE FOR LSI PACKAGING High-precision packaging for LSI chips is
one of the keys to increasingly compact, lightweight and highly functional mobile
devices. To strengthen its position in this core technology, in November 1999 Casio
joined with Oki Electric Industry Co., Ltd. to establish a joint venture, Integrated
Electronics and Packaging Technologies, Inc. (IEP Technologies), to develop wafer-level
chip-sized packaging (CSP) technologies.
Wafer-level CSP technologies involve the fabrication of LSI chips on the surface of the
wafer, copper redistribution, terminal finish and encapsulating the chips with resin be-
fore dicing. With packages that are the same size as the chips, this method meets
demanding requirements for size and weight reduction, higher functions and lower cost.
By combining Casio’s LSI design technologies accumulated as an electronic product
manufacturer with Oki’s semiconductor manufacturing expertise, IEP Technologies is
well positioned to take the technological lead and establish the industry standard in this
promising area. In the future, the venture aims to develop next-generation technologies
and systems for high-precision packaging.
CONTINUED STRONG PERFORM ANCE AT CASIO MICRONICS Casio Micronics Co., Ltd. is
benefiting from robust demand growth for its connecting devices represented by film
devices and bump processing. In response, Casio Micronics invested in a new
production base for film devices in Yamanashi Prefecture, which went online in April
2000 with mass production starting in July. The plant is equipped with highly efficient
film circuit board manufacturing equipment and has production capacity 2.2 times
greater than previous facilities.
In May 2000, Casio Micronics began work to expand bump processing capacity at its
Ome Plant in Tokyo. The expansion project is targeting a sharp rise in capacity, from
150 thousand wafers per month currently to 200 thousand per month. Completion is
scheduled for August.
We expect demand for connecting devices to spread from cellular handsets and note-
book PCs to portable information appliances. With favorable growth prospects, Casio
Micronics is targeting an initial public offering (IPO) in the future.
ELECTRONIC COM PONENTS AND OTHERS
Loaded with 522 tones using the newly
developed Zygotech Polynomial Interpolation
(ZPI), this electronic keyboard is Casio’s
highest-end model.
This model combines CD, MD and cassette
tape players with a radio receiver.
High market growth for mobile electronic
products supported strong sales of our color
STN-LCDs, as well as HAST-LCDs.
This LCD module for our new WRIST CAMERA
employs chip on film (COF) technology to
mount LSI chips directly onto plastic film with
printed circuits.