AMD 2002 Annual Report Download - page 284
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EXHIBIT C
AMD STAFFING ALLOCATION*
Technical
AREA
EXAMPLE
Proposed
AMD Engineers**
FEOL Integration Integration TBD
FEOL Unit Process RIE, Hot, Clean, CMP, CVD, Silicide, oxide TBD
Other FEOL Module Development SOI material, SiGe, etc. TBD
Lithography Resist, metrology, OPC, Stepper Application TBD
Other Lithography +
Model
Data prep, Modeling, ESD
TBD
BEOL Integration Integration TBD
BEOL Unit Process SiLK, CVD, RIE, Liner, CMP TBD
Device Design Device, Characterization, manual TBD
Device Device Modeling, SPICE Modeling TBD
Product Engineering Associated with Process
Qualification
Test Program, Failure Analysis
TBD
***
* The Staffing Allocation will be determined by the mutual agreement of the IBM Project Leader and AMD Deputy Project Leader.
** These engineers are expected to be productive immediately and should have enough experience in the given technology area to work independently and
lead sub teams.
*** Confidential information omitted and filed separately with the Securities and Exchange Commission.
Source: ADVANCED MICRO DEVIC, 10-K, March 14, 2003