Casio 2008 Annual Report Download - page 15

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Highlights of the Year
CXD NEXT established — launches online electronic cash
register service
Casio and NTT DoCoMo, Inc. jointly established CXD NEXT Co., Ltd. in July 2007. The new company offers
support services for retail outlets equipped with Casio-made NetRegi (electronic cash registers with virtual
private network (VPN) capability and reader/writer compatibility for mobile settlement services). CXD NEXT is
focusing on the provision of electronic settlements (utilizing the iDTM mobile credit-card platform or magnetic
stripe credit cards), as well as a sales data management service that enables retailers to monitor shop sales on
a website and to easily transfer sales data to cell phones.
CXD NEXT’S new system is much less expensive than the creation of a PoS system or the introduction of a
conventional electronic clearing system.
Thanks to its combination of the store support know-how possessed by Casio (which holds the No. 1
Japanese market share in electronic cash registers)
with the expertise in the fi eld of digital settlement
systems possessed by NTT DoCoMo (which operates
the iDTM mobile credit-card platform), this new
service, which is targeted at companies operating
store chains — from small to nationwide — helps
raise store operational effi ciency and leads to
improved customer service.
Casio Micronics’ film device business transferred to
Hitachi Cable
In March 2008, Casio subsidiary Casio Micronics Co., Ltd. signed an agreement to transfer its Film Device
Business to Hitachi Cable, Ltd. To make this possible, the Company concluded a memorandum of under-
standing with Casio Micronics Co., Ltd. regarding an issuance of shares by Casio Micronics through private
placement, making the company into a wholly owned subsidiary of Casio Computer Co., Ltd. by means of
exchange of shares.
We will take advantage of our increased control over Casio Micronics to improve the company’s
nancial position. We will pursue a radical strategy, including business alliances in the fi eld of bump
processing — including wafer-level chip-size packages (W-CSP) — to create a framework that allows fl exible
decision-making. In this way, we will strengthen the enterprise value of the entire Casio Group.
13
Annual Report 2008