Crucial 2015 Annual Report Download - page 97

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95
10.27* Product Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and
Micron Semiconductor Asia PTE LTD (24)
10.28* Wafer Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and
Micron Singapore (24)
10.29 Form of Capped Call Confirmation dated April 2012 (1)
10.30* Supply Agreement, dated January 17, 2013, by and among Micron Technology, Inc., Micron Semiconductor
Asia Pte. Ltd. and Inotera Memories, Inc. (25)
10.31* Joint Venture Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx
Holdings B.V., Micron Technology Asia Pacific, Inc. and Nanya Technology Corporation (25)
10.32* Facilitation Agreement, dated January 17, 2013, by and among Micron Semiconductor B.V., Numonyx
Holdings B.V., Micron Technology Asia Pacific, Inc., Nanya Technology Corporation and Inotera
Memories, Inc. (25)
10.33 Micron Guaranty Agreement, dated January 17, 2013, by Micron Technology, Inc. in favor of Nanya
Technology Corporation (25)
10.34* Technology Transfer and License Option Agreement for 20NM Process Node, dated January 17, 2013, by
and between Micron Technology, Inc. and Nanya Technology Corporation (26)
10.35* Omnibus IP Agreement, dated January 17, 2013, by and between Nanya Technology Corporation and
Micron Technology, Inc. (25)
10.36* Second Amended and Restated Technology Transfer and License Agreement for 68-50NM Process Nodes,
dated January 17, 2013, by and between Micron Technology, Inc. and Nanya Technology Corporation (26)
10.37* Third Amended and Restated Technology Transfer and License Agreement, dated January 17, 2013, by and
between Micron Technology, Inc. and Nanya Technology Corporation (25)
10.38* Omnibus IP Agreement, dated January 17, 2013, by and between Micron Technology, Inc. and Inotera
Currency Option Transaction 590297603-2 Trade Date March 26, 2013, by and between Micron
Technology, Inc. and Deutsche Bank AG, London Branch (25)
10.39* English Translation of Front-End Manufacturing Supply Agreement, dated July 31, 2013, by and between
Micron Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc. (27)
10.40* English Translation of Research and Development Engineering Services Agreement, dated July 31, 2013, by
and between Micron Technology, Inc. and Elpida Memory, Inc. (6)
10.41* English Translation of General Services Agreement, dated July 31, 2013, by and between Micron
Semiconductor Asia Pte. Ltd. and Elpida Memory, Inc. (27)
10.42 Form of Capped Call Confirmation dated February 2013 (2)
10.43 Purchase Agreement, dated as of February 5, 2014, by and among Micron Technology, Inc. and Morgan
Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of
the initial purchasers (28)
10.44 Registration Rights Agreement, dated as of February 10, 2014, by and among Micron Technology, Inc. and
Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as
representatives of the initial purchasers (14)
10.45 Purchase Agreement, dated as of July 23, 2014, by and among Micron Technology, Inc. and Morgan Stanley
& Co LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as representatives of the initial
purchasers (29)
10.46 Registration Rights Agreement dated as of July 28, 2014, by and among Micron Technology, Inc. and
Morgan Stanley & Co. LLC, Goldman, Sachs & Co. and Credit Suisse Securities (USA) LLC, as
representatives of the initial purchasers (15)
10.47 Credit Agreement dated as of December 2, 2014 among Micron Technology, Inc. and Micron
Semiconductor Products, Inc., as Borrowers, HSBC Bank USA, N.A., as Administrative Agent, Co-
Collateral Agent, Joint Lead Arranger and Joint Book Runner, JPMorgan Chase Bank, N.A., as Co-
Collateral Agent and Syndication Agent, J.P. Morgan Securities LLC, as Joint Lead Arranger and Joint Book
Runner, Bank of America, N.A., Citigroup Global Markets, Inc. and Wells Fargo Bank, N.A., as Joint Book
Runners and Co-Documentation Agents, and certain financial institutions, as lenders. (30)
10.48 Facility Agreement, dated February 12, 2015, among Micron Semiconductor Asia Pte. Ltd., as borrower,
certain financial institutions party thereto, and The Hongkong and Shanghai Banking Corporation Limited,
as facility agent, security agent and account bank. (32)
10.49* 2015 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron
Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc. (33)
10.50* 2016 Supply Agreement, dated February 10, 2015, by and among Micron Technology, Inc., Micron
Semiconductor Asia Pte. Ltd. and Inotera Memories, Inc. (33)
10.51* Amended and Restated Supply Agreement, dated September 1, 2015, by and among Micron Technology,
Inc., Intel Corporation and Micron Semiconductor Asia Pte. Ltd.