Crucial 2015 Annual Report Download - page 96

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94
4.18 Indenture dated as of December 16, 2013, by and among Micron Semiconductor Asia Pte., Ltd., Wells
Fargo Bank, National Association, and Export-Import Bank of the United States (13)
4.19 Indenture dated as of February 10, 2014, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee (14)
4.20 Form of Note (included in Exhibit 4.19) (14)
4.21 Indenture, dated as of July 28, 2014, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee (15)
4.22 Form of Note (included in Exhibit 4.21) (15)
4.23 Indenture, dated as of April 30, 2015, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee. (8)
4.24 Indenture, dated as of April 30, 2015, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee. (8)
4.25 Form of Note (included in Exhibit 4.23). (8)
4.26 Form of Note (included in Exhibit 4.24). (8)
4.27 Indenture, dated as of February 3, 2015, by and between Micron Technology, Inc. and U.S. Bank National
Association, as Trustee. (35)
4.28 Form of Note (included in Exhibit 4.27). (35)
10.1 Executive Officer Performance Incentive Plan, as Amended (34)
10.2 1997 Nonstatutory Stock Option Plan, as Amended (4)
10.3 1998 Nonstatutory Stock Option Plan, as Amended (4)
10.4 2001 Stock Option Plan, as Amended (4)
10.5 2001 Stock Option Plan Form of Agreement (17)
10.6 2004 Equity Incentive Plan, as Amended and Restated
10.7 2004 Equity Incentive Plan Forms of Agreement and Terms and Conditions
10.8 Amended and Restated 2007 Equity Incentive Plan
10.9 2007 Equity Incentive Plan Forms of Agreement
10.10 Nonstatutory Stock Option Plan, as Amended
10.11 Nonstatutory Stock Option Plan Form of Agreement and Terms and Conditions
10.12 Numonyx Holdings B.V. Equity Incentive Plan (18)
10.13 Numonyx Holdings B.V. Equity Incentive Plan Forms of Agreement (18)
10.14* Patent License Agreement dated September 15, 2006, by and among Toshiba Corporation, Acclaim
Innovations, LLC and Micron Technology, Inc. (19)
10.15 Form of Indemnification Agreement between the Registrant and its officers and directors (13)
10.16* Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation
(20)
10.17* Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC
(20)
10.18 Form of Severance Agreement (21)
10.19 Share Purchase Agreement by and among Micron Technology, Inc. as the Buyer Parent, Micron
Semiconductor B.V., as the Buyer, Qimonda Ag as the Seller Parent and Qimonda Holding B.V., as the
Seller Sub dated as of October 11, 2008 (16)
10.20 Form of Capped Call Confirmation dated as of July 20, 2011, between Micron Technology, Inc. and Société
Genérale (22)
10.21 Form of Capped Call Confirmation dated as of July 22, 2011 (22)
10.22* 2012 Master Agreement by and among Intel Corporation, Intel Technology Asia PTE LTD, Micron
Technology, Inc., Micron Semiconductor Asia PTE LTD, IM Flash Technologies, LLC and IM Flash
Singapore, LLP dated February 27, 2012 (23)
10.23* Second Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies,
LLC dated April 6, 2012, between Micron Technology, Inc. and Intel Corporation (24)
10.24* Amendment to the Master Agreement dated April 6, 2012, between Intel Corporation and Micron
Technology, Inc. (24)
10.25* Amended and Restated Supply Agreement dated April 6, 2012, between Intel Corporation and IM Flash
Technologies, LLC (24)
10.26* Amended and Restated Supply Agreement dated April 6, 2012, between Micron Technology, Inc. and IM
Flash Technologies, LLC (24)