Crucial 2012 Annual Report Download - page 95

94
10.8 2001 Stock Option Plan, as Amended
10.9 2001 Stock Option Plan Form of Agreement (12)
10.10 2002 Employment Inducement Stock Option Plan, as Amended (10)
10.11 2004 Equity Incentive Plan, as Amended
10.12 2004 Equity Incentive Plan Forms of Agreement and Terms and Conditions (11)
10.13 Nonstatutory Stock Option Plan, as Amended
10.14 Nonstatutory Stock Option Plan Form of Agreement and Terms and Conditions (11)
10.15 Lexar Media, Inc. 2000 Equity Incentive Plan, as Amended (10)
10.20* Settlement and Release Agreement dated September 15, 2006, by and among Toshiba Corporation, Micron
Technology, Inc. and Acclaim Innovations, LLC (13)
10.21* Patent License Agreement dated September 15, 2006, by and among Toshiba Corporation, Acclaim
Innovations, LLC and Micron Technology, Inc. (13)
10.22* Omnibus Agreement dated as of February 27, 2007, between Micron Technology, Inc. and Intel Corporation
(14)
10.23* Limited Liability Partnership Agreement dated as of February 27, 2007, between Micron Semiconductor Asia
Pte. Ltd. And Intel Technology Asia Pte. Ltd. (14)
10.24* Supply Agreement dated as of February 27, 2007, between Micron Semiconductor Asia Pte. Ltd. And IM
Flash Singapore, LLP (14)
10.25* Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies, LLC
dated as of February 27, 2007, between Micron Technology, Inc. and Intel Corporation (14)
10.26* Supply Agreement dated as of February 27, 2007, between Intel Technology Asia Pte. Ltd. and IM Flash
Singapore, LLP (14)
10.27 Form of Indemnification Agreement between the Registrant and its officers and directors (15)
10.28 Form of Severance Agreement between the Company and its officers (16)
10.29 Form of Agreement and Amendment to Severance Agreement between the Company and its officers (17)
10.36* Master Agreement dated as of November 18, 2005, between Micron Technology, Inc. and Intel Corporation
(18)
10.38* Manufacturing Services Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM
Flash Technologies, LLC (18)
10.40* MTV Lease Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash
Technologies, LLC (18)
10.41* Product Designs Assignment Agreement dated January 6, 2006, between Intel Corporation and Micron
Technology, Inc. (18)
10.42* NAND Flash Supply Agreement, effective as of January 6, 2006, between Apple Computer, Inc. and Micron
Technology, Inc. (18)
10.43* Supply Agreement dated as of January 6, 2006, between Micron Technology, Inc. and IM Flash
Technologies, LLC (18)
10.44* Supply Agreement dated as of January 6, 2006, between Intel Corporation and IM Flash Technologies, LLC
(18)
10.45 Capped Call Confirmation (Reference No. CEODL6) by and between Micron Technology, Inc. and Morgan
Stanley & Co. International plc (1)
10.46 Capped Call Confirmation (Reference No. 53228800) by and between Micron Technology, Inc. and Credit
Suisse International (1)
10.47 Capped Call confirmation (Reference No. 53228855) by and between Micron Technology, Inc. and Credit
Suisse International (1)
10.48 2007 Equity Incentive Plan, as Amended
10.49 2007 Equity Incentive Plan Forms of Agreement (19)
10.50 Severance Agreement dated April 9, 2008, between Micron Technology, Inc. and Ronald C. Foster (20)
10.51* Master Agreement dated as of April 21, 2008, by and between Nanya Technology Corporation and Micron
Technology, Inc. (21)
10.52* Joint Venture Agreement dated as of April 21, 2008, by and between Micron Semiconductor B.V. and Nanya
Technology Corporation (21)