AMD 2005 Annual Report Download - page 19

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Table of Contents
Manufacturing, Assembly and Test Facilities
We own and operate five manufacturing facilities, of which two are wafer fabrication facilities and three are assembly and test facilities.
Our microprocessor fabrication is conducted at the facilities described in the chart below:
Facility Location
Wafer Size
(diameter in
millimeters)
Principal
Production
Technology
(in nanometers)
Approximate
Clean Room
Square
Footage
Dresden, Germany
Fab 30 200 90 150,000
Fab 36 300 90 140,000
As of December 25, 2005, we manufactured our microprocessor products at Fab 30, on 90-nanometer process technology. We started production at Fab 36
in late 2005, and we intend to make production shipments of wafers manufactured using 90-nanometer technology in the first quarter of 2006. By the end of
2006, we intend to begin manufacturing using 65-nanometer technology. Our goal is to be substantially converted to 65-nanometer technology in Fab 36 by
mid-2007. Use of 300-millimeter wafers can contribute to decreasing manufacturing costs per unit and helps increase capacity by yielding significantly more
chips per wafer than 200-millimeter wafers. Use of smaller process geometries allows us to put more transistors on an equivalent size chip, which can result in
products that are higher performing, use less power and/or cost less to manufacture. We currently plan to add production output on a steady year-to-year basis
and to keep fab utilization at high levels.
In addition, we have sourcing and manufacturing technology agreements with Chartered Semiconductor Manufacturing pursuant to which Chartered will
become an additional manufacturing source for our AMD64-based microprocessors. We intend to use the additional capacity provided by Chartered to augment
production at our manufacturing facilities. We expect that Chartered will commence production for us in 2006.
We have foundry arrangements with third parties for the production of our embedded processor and chipset products.
We have also developed an approach to manufacturing that we call Automated Precision Manufacturing, or APM. APM comprises a suite of automation,
optimization and real-time data analysis technologies which automate the way decisions are made within our fabrication facilities. We use APM during process
technology transitions, and believe APM enables greater efficiency, higher baseline yields, better binning and faster yield learning.
Our current assembly and test facilities are described in the chart set forth below:
Facility Location
Approximate
Manufacturing
Area Square
Footage Activity
Penang, Malaysia 112,000 Assembly & Test
Singapore 194,000 Test
Suzhou, China 44,310 Test, Mark & Packaging
Some assembly and final testing of our microprocessor and personal connectivity solutions products is also performed by subcontractors in the United
States and Asia.
14
Source: ADVANCED MICRO DEVIC, 10-K, February 27, 2006