AMD 1996 Annual Report Download - page 88

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improvements but shall exclude the acquisition and installation of the Wafer
Process Equipment (defined in Section 1.3.2 below). The Preliminary Design of
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the Facility is represented or described in documents described in List of
Mechanical Drawings dated November 14, 1996 and List of Architect's Drawings
dated November 14, 1996 and in Preliminary Design Report dated November 14,
1996, which are incorporated herein by this reference (collectively referred to
as the "FAB 30 PRELIMINARY DESIGN"). In the event that any changes are made in
the scope of the Facility, any corresponding changes in the Fab 30 Preliminary
Design shall be made by Change Order (defined in Section 10.1 below).
------------
CONTRACTOR shall provide the design development, engineering, construction
management and all ancillary construction services, and appurtenances of every
description which are necessary to construct and start the Facility in
accordance with the Fab 30 Preliminary Design and the Contract.
1.2 PROJECT. The Project for which CONTRACTOR shall be responsible is the
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design development, engineering, construction management, furnishing,
fabrication, construction, erection, installation, equipping, starting up,
testing, calibrating, and adjusting of the Facility, including without
limitation all design services, all construction management services and all
construction services, together with all necessary appurtenances (collectively,
the "PROJECT"). The Project comprises the completed construction of the
Facility as designed by CONTRACTOR and approved by COMPANY and includes without
limitation (i) all labor, tools, construction equipment, fuel, transportation,
utilities, water and all other facilities and services necessary to ready the
Site for construction and to complete all site work (including without
limitation installation of all utilities, wastewater disposal and sewage
disposal systems) and to complete such construction and (ii) all materials
incorporated and to be incorporated in such construction and (iii) all building
systems and building equipment to be installed as an integral part of the
buildings, structures and other improvements comprising the Facility as
described in the Fab 30 Preliminary Design.
1.3 DESIGN AND ENGINEERING SERVICES.
-------------------------------
1.3.1 ENGINEERING SERVICES. CONTRACTOR shall furnish structural,
--------------------
mechanical, electrical, plumbing, civil engineering and landscaping services as
part of CONTRACTOR'S design services.
1.3.2 DESIGN AND ENGINEERING BY CONTRACTOR. Except for the process
------------------------------------
design referred to in Section 1.3.4, based upon the Fab 30 Preliminary Design,
-------------
CONTRACTOR shall furnish the completed design for the Facility. CONTRACTOR
shall make detailed checks of the design information furnished by COMPANY to
satisfy itself as to the accuracy thereof and shall be responsible for the
complete mechanical and electrical design of the Facility and of all systems
necessary for a complete and operational Facility with the exception of
furnishing tooling, equipment and machinery to be furnished and installed by
COMPANY for the manufacture and design of integrated circuits (the "WAFER
PROCESS EQUIPMENT"). CONTRACTOR shall be responsible for:
1.3.2.1 DESIGN DOCUMENTS. Developing and preparing for
----------------
COMPANY'S approval complete and coordinated plans, specifications, working
drawings, data sheets and other construction documents for the Project
which are necessary for the construction of the Facility (the "DESIGN
DOCUMENTS"). Each time the Design Documents are revised, the revised Design
Documents shall: (1) bear a sequential number (indicating the numerical
sequence of such revision), (2) show the changes from the prior revision,
(3) show the date of the revision, (4) show the date of COMPANY'S and
CONTRACTOR'S mutual approvals and (5) show the name(s) of COMPANY'S and
CONTRACTOR'S Representative(s) who approved the revision. The development
of the design of the Facility and the preparation of the Design Documents
are described in more detail in Article 4 below.
---------
2
Source: ADVANCED MICRO DEVIC, 10-K, March 20, 1997