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10
M anagement ’s Discussion and Analysis
Operations (Toshiba Matsushita Display Technology Co., Ltd., whose trade name was changed to Toshiba Mobile Display
Co., Ltd. on May 25, 2009), parts of its manufacturing facilities were retired and/or sold.
PLANS FOR CONSTRUCTING NEW FACILITIES AND RETIRING EXISTING FACILITIES
At the end of this fiscal year ending March 31, 2009, investment in new facilities and equipment upgrades, including intangi-
ble assets, in FY 2009 and FY 2010 are projected to total 250.0 billion yen and 450.0 billion yen, respectively (based on the
value of orders placed and including intangible assets; hereinafter the same). This figure includes 32.8 billion yen (FY 2009)
and 117.0 billion yen (FY 2010), which is the Toshiba’s portion of the investment made by Flash Alliance, Ltd. and others,
which are companies accounted for by the equity method. The funds for capital expenditures will be financed by the equity
finance, internal funds and borrowings. The funds raised by the equity finance are the proceeds from the public offering on
June 3, 2009 (including the sale of shares to international investors) and the capital increase by way of third-party allotment
on June 23, 2009.
(As of M arch 31, 2009)
Business Segment
Digital Products
Electronic Devices
Social
Infrastructures
Home Appliances
Others
Total
Planned Capital
Investments for
FY 2009
(billion yen)
24.0
98.0
102.0
11.0
15.0
250.0
Planned Capital
Investments for
FY 2010
(billion yen)
39.0
240.0
105.0
25.0
41.0
450.0
M ajor Contents and Purposes
M anufacturing facilities for HDDs, etc.
M anufacturing facilities for NAND flash memories, etc.
Expansion of investment for nuclear power business, enhance-
ment of overseas manufacturing bases of thermal power busi-
ness and manufacturing facilities for new type rechargeable
battery, etc.
M anufacturing facilities for new lighting, etc.
—
—
(Notes) 1) Consumption taxes are not included in t hese capital investment s.
2) Retiring material facilit ies is not planned except for routine renewal of facilit ies.
3) The major planned new facilit ies and equipment upgrades in FY 2009 are as follows:
(As of M arch 31, 2009)
Name of
Company and
Office
Place Business
Segment Type of
Facility Planned
Capital
Investments
(billion yen)
Yokkaichi
Operations of
Toshiba
Flash Alliance,
Ltd., etc.
Keihin Product
Operations of
Toshiba
Westinghouse
Electric
Company, etc.
New offices of
Toshiba
(undetermined)
Yokkaichi, M ie
Yokkaichi, M ie
Tsurumi,
Yokohama
Pennsylvania,
United States,
etc.
—
Electronic
Devices
Electronic
Devices
Social
Infrastructures
Social
Infrastructures
Social
Infrastructures
M anufacturing
facilities for
semiconductors
M anufacturing
facilities for
semiconductors
M anufacturing
facilities for
devices for
nuclear,
thermal and
hydroelectric
power
M anufacturing
facilities for
nuclear power
plants and fuel
M anufacturing
facilities for
new type
rechargeable
battery
22.0
32.8
12.7
14.2
10.4
Planned Beginning and
Completion of
Construction
Beginning Completion
April 2009
April 2009
July 2009
April 2009
September
2009
August 2010
October 2010
M arch 2012
M arch 2010
September
2010
Capacity
Improvement
after
Completion
of
Construction
300mm finer
lithography,
etc.
300mm finer
lithography,
etc.
Improvement of
manufacturing
capacity of
devices for
nuclear, thermal
and hydroelec-
tric power, etc.
Improvement of
manufacturing
capacity of
nuclear power
plants and fuel,
etc.
M anufacturing
facilities for new
type recharge-
able battery, etc.