Oki 2001 Annual Report Download - page 13

Oki Electric Industry Co., Ltd. Annual Report 2001 11
Silicon Solutions Company
SiSC focuses on logic and system LSIs. In line
with its role as a solutions company working in
digital communications, SiSC is promoting a
basic architecture—called silicon platform archi-
tecture (SPA)—which it has used to develop the
Mobile µ-PLAT®, a power-saving silicon plat-
form for mobile use based on a central process-
ing unit (CPU) licensed from Advanced RISC
Machines (ARM) Ltd. SiSC also offers the
Mobile µ-PLAT mounted with ML7070-01, the
industry’s first single-chip mobile data communi-
cations processor. Connected to a mobile tele-
phone or personal handy-phone system (PHS)
and a laptop computer or information machine
such as a personal digital assistant (PDA), this
LSI facilitates easy Internet data communication.
A pulse code modulation (PCM) sound LSI,
developed in cooperation with Casio
Computer Co., Ltd., was marketed to DDI
Optical Components Company
The optical fiber market is expanding rapidly,
particularly in the United States. OCC has devel-
oped such products as 10 gigabit-per-second
(Gb/s) transmitters, gallium arsenide (GaAs)
integrated circuit (IC) chipsets for 10 Gb/s trans-
mitter/transceiver modules, 10 Gb/s transponders
for optical wavelength multiplex communication
monitors, and laser modules for use as fiber-optic
service channels. OCC supplies these products
primarily to major optical fiber system manufac-
turers in the United States and Japan. OCC was
established in April 2000 and achieved profitabil-
ity in fiscal 2001, recording a 185.0% increase
in sales.
OCC is expanding its business, particularly in
optical fiber devices and modules. We will accel-
erate efforts to develop 40 Gb/s devices for long-
haul networks, surface mount technology devices
for access networks, and 1.4 µm range high-power
pump lasers, all based on OCC’s expertise in
GaAs IC and laser diode technologies.
Pocket’s “feel H” (“feel edge”) telephone.
Because it uses the same PCM sound methods
used in electronic instruments, this LSI enables
extremely high-fidelity music and sound repro-
duction while also improving the musical
expression of the selections.
The Bluetooth wireless technology for short-
distance networks is expected to facilitate the
connection of electronic devices without cables
in the near future, and we are currently in the
middle of the qualification process for the latest
commercial version, 1.1. We will strive to ensure
a performance advantage by using silicon-on-
insulator (SOI) technology, which enables high
speeds and low power consumption.
In fiscal 2001, we endeavored to raise the effi-
ciency of SiSC’s operations by collaborating
with Hoya Corporation in the area of semicon-
ductor photomasks, and with Grace Semicon-
ductor Manufacturing Corporation.
Electronic
Devices
Total solutions products for
Bluetooth technology enable
short-distance wireless
communications.
Oki has developed a com-
pact, low power consump-
tion integrated modular
semiconductor laser for
the next 40 Gb/s high
speed optical communica-
tion systems.
Tetsuzo Taniguchi
Company President
Masayoshi Ino
Company President
This LSI circuit for new mobile
terminals uses all-sound pulse
code modulation (PCM).
The BT-SDK system development kit
makes it possible to develop software and
hardware for Bluetooth applications.