AMD 2011 Annual Report Download - page 132

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Exhibit
Number Description of Exhibits
**10.38 Intellectual Property Cross-License Agreement by and between Advanced Micro Devices, Inc.,
and Broadcom Corporation filed as Exhibit 10.2 to AMD’s Quarterly Report on Form 10-Q for the
period ended September 27, 2008, is hereby incorporated by reference.
**10.39 IP Core License Agreement by and between Advanced Micro Devices, Inc., and Broadcom
Corporation filed as Exhibit 10.3 to AMD’s Quarterly Report on Form 10-Q for the period ended
September 27, 2008, is hereby incorporated by reference.
10.40 Shareholders’ Agreement dated March 2, 2009 by and among Advanced Micro Devices, Inc.,
Advanced Technology Investment Company LLC, and The Foundry Company filed as
Exhibit 10.3 to AMD’s Current Report on Form 8-K dated March 5, 2009, is hereby
incorporated by reference.
10.40(a) Amended and Restated Shareholders’ Agreement by and among Advanced Micro Devices, Inc.,
Advanced Technology Investment Company LLC, ATIC International Investment Company LLC
and GLOBALFOUNDRIES Inc. dated December 27, 2010 filed as Exhibit 10.44(a) to AMD’s
Annual Report on Form 10-K for the fiscal year ended December 25, 2010, is hereby incorporated
by reference.
10.41 Funding Agreement dated March 2, 2009 by and among Advanced Micro Devices, Inc.,
Advanced Technology Investment Company LLC, and The Foundry Company filed as
Exhibit 10.4 to AMD’s Current Report on Form 8-K dated March 5, 2009, is hereby
incorporated by reference.
10.41(a) Amended and Restated Funding Agreement by and among Advanced Micro Devices, Inc.,
Advanced Technology Investment Company LLC and GLOBALFOUNDRIES Inc. dated
December 27, 2010 filed as Exhibit 10.45(a) to AMD’s Annual Report on Form 10-K for the fiscal
year ended December 25, 2010 is hereby incorporated by reference.
**10.42 Wafer Supply Agreement dated March 2, 2009 by and among Advanced Micro Devices, Inc., The
Foundry Company and AMD Fab Technologies US Inc., filed as Exhibit 10.5 to AMD’s Current
Report on Form 8-K dated March 5, 2009, is hereby incorporated by reference.
**10.42(a) Wafer Supply Agreement Amendment No. 1 by and among Advanced Micro Devices, Inc.,
GLOBALFOUNDRIES Inc., GLOBALFOUNDRIES U.S. INC., and GLOBALFOUNDRIES
SINGAPORE PTE. LTD. dated as of March 29, 2011 filed as Exhibit 10.1 to AMD’s Quarterly
Report on Form 10-Q/A for the period ended April 2, 2011, is hereby incorporated by reference.
*10.43 Offer Letter—Thomas Seifert dated August 31, 2009 filed as Exhibit 10.1 to AMD’s Current
Report on Form 8-K dated October 8, 2009, is hereby incorporated by reference.
*10.44 Relocation Expenses Agreement—Thomas Seifert dated August 31, 2009 by and between
Advanced Micro Devices, Inc. and Thomas Seifert filed as Exhibit 10.2 to AMD’s Current Report
on Form 8-K dated October 8, 2009, is hereby incorporated by reference.
*10.45 Sign-On Bonus Agreement—Thomas Seifert dated August 31, 2009 by and between Advanced
Micro Devices, Inc. and Thomas Seifert filed as Exhibit 10.3 to AMD’s Current Report on Form 8-
K dated October 8, 2009, is hereby incorporated by reference.
*10.46 Offer Letter (including form Change in Control Agreement)—Emilio Ghilardi dated December 18,
2008 filed as Exhibit 10.62 to AMD’s Annual Report on Form 10-K for the fiscal year ended
December 26, 2009 is hereby incorporated by reference.
*10.47 Sign-On Bonus Agreement dated January 14, 2009 by and between Advanced Micro Devices, Inc.
and Emilio Ghilardi filed as Exhibit 10.63 to AMD’s Annual Report on Form 10-K for the fiscal
year ended December 26, 2009 is hereby incorporated by reference.
10.48 Settlement Agreement dated November 17, 2009 between Advanced Micro Devices, Inc. and Intel
Corporation filed as Exhibit 10.1 to AMD’s Current Report on Form 8-K dated November 17,
2009, is hereby incorporated by reference.
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