Qualcomm 2005 Annual Report Download - page 24
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Please find page 24 of the 2005 Qualcomm annual report below. You can navigate through the pages in the report by either clicking on the pages listed below, or by using the keyword search tool below to find specific information within the annual report.20 qualcomm 2005
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innovation
we continue to
focus on performance leadership
for 3g wireless
integrated solutions to
drive down costs
QUALCOMM is continuously focused
on lowering the costs and increasing the
effectiveness of wireless technology.
With the most advanced and highly
integrated 3G CDMA chipset solutions
(semiconductors and system software)
in the world today, the Company helps
manufacturers achieve savings by
reduc ing their bill of materials costs
and enabling faster time to market.
Consumers enjoy the benefi ts of having
smaller, lighter devices with more ad-
vanced features and longer battery life.
A New Single Chip Architecture
This year, QUALCOMM announced the
world’s only single-chip CDMA2000
solution. By integrating multimedia,
baseband, radio transceiver and power
management into a single package,
the QUALCOMM Single Chip™ (QSC™)
family of products helps drive down
handset costs.
A New Transceiver Solution
The fi rst RF CMOS-based transceiver
for CDMA2000 was introduced this
year. Integrated into QUALCOMM’s
single-chip solution, it overcomes the
interference sometimes experienced
from placing the receive and transmit
functions on the same device.
increasing voice capacity
and data speed
To meet growing demand for rich
multimedia, operators want to
deliver wireless high-speed data at
cost-effective prices. This is desirable
because it produces higher revenue
per user and increases profi tability
across the wireless value chain. To that
end, QUALCOMM continues to innovate
with new solutions aimed at increasing
wireless capacity and speed.
The New Receive Diversity Solution
This year QUALCOMM announced the
industry’s fi rst single-chip receive
diversity solution. It uses an additional
antenna and associated receive chain
to support improved signal reception,
enabling higher data throughput and sig-
nifi cant increases in network capacity.
The Next Evolution in High-Speed Data
EV-DO solutions have enabled wireless
users to experience advanced data
applications and Internet access at
broadband speeds. The next evolution
of CDMA2000, EV-DO Revision A, is
planned for launch in 2006. Along with
major capacity improvements, it sup-
ports signifi cantly faster data rates.
QUALCOMM was fi rst to market with
commercial solutions for the new tech-
nology and offers complete solutions
for EV-DO Rev. A.
QUALCOMM has also emerged as an
industry leader in high-speed downlink
packet access (HSDPA) technology,
the next feature of the WCDMA (UMTS)
standard that enables new services
requiring higher data speeds and
greater network capacity. The Company
sampled the world’s fi rst HSDPA solu-
tion in early 2005 and saw devices
become commercially available less
than 12 months later. Additional
HSDPA handsets and devices are
expected throughout 2006 as the
Company samples new solutions for
high-speed uplink packet access
(HSUPA), which delivers support for
low-latency applications.
The Fourth-Generation Vocoder™
(4GV™) Solution
To enhance EV-DO Rev. A, QUALCOMM
designed the 4GV codec. Wireless oper-
ators can double their network capacity
by deploying 4GV in conjunction with
receive diversity technology. The Qual ity
of Service (QoS) feature enriches the
user experience for delay-sensitive appli-
cations, including IP-based services
like VoIP and other real-time applica-
tions such as push-to-talk, video
telephony and multi-player gaming
services that combine immediate voice
with simultaneous delivery of video
or pictures.
a new division focused on
next-generation display
technology
The new QUALCOMM MEMS Tech-
nologies (QMT) division is focused on
rapidly increasing the capability of
dis play screens, while driving down
cost and power consumption.
QMT is developing iMoD™ displays—a
next-generation display technology
for a full range of mobile products.
This potentially industry-transforming
display technology combines thin fi lm