Dow Chemical 2015 Annual Report Download - page 20

10
Products
Infrastructure Solutions' businesses each serve one or more key market segments, as noted below:
Business Applications/Market Segments Major Products
Dow Building &
Construction
Rigid and spray foam insulation; weatherization,
waterproofing and air sealing; caulks and
sealants; elastomeric roof coatings; exterior
insulation finishing systems; roof tiles and siding;
industrial non-wovens; cement-based tile
adhesives; plasters and renders; tape joint
compounds; and concrete additives
AQUASET™ acrylic thermosetting resins,
DOW™ latex powder, FROTH-PAK™ foam
insulation and sealants, GREAT STUFF™
insulating foam sealants and adhesives,
RHOPLEX™ and PRIMAL™ acrylic emulsion
polymers, STYROFOAM™ brand insulation
products, THERMAX™ exterior insulation,
WALOCEL™ cellulose ethers,
WEATHERMATE™ house wrap,
XENERGY™ high performance insulation,
LIQUID ARMOR™ flashing and sealant
Dow Coating
Materials
Acrylic binders for architectural paint and
coatings, industrial coatings, and paper;
dispersants; rheology modifiers; opacifiers and
surfactants for both architectural and industrial
applications; protective and functional coatings
ACRYSOL™ Rheology Modifiers, AVANSE™
acrylic binders, EVOQUE™ Pre-Composite
Polymer, FORMASHIELD™ acrylic binder,
RHOPLEX™ acrylic resin, TAMOL™
Dispersants, MAINCOTE™ acrylic epoxy
hybrid, PARALOID™ Edge ISO-free
technology and ACOUSTICRYL™ liquid-
applied sound damping technology
Energy & Water
Solutions
Helping customers in exploration, production,
transmission, refining and gas processing to
optimize supply, improve efficiencies and manage
emissions. Providing expertise and localized
solutions for microbial control for well souring,
industrial cooling water, fabric odor elimination,
in-can preservation and dry film protection.
Providing advanced, cost effective separation and
purification technology for water treatment and
filtration, pharmaceutical, food and beverage, and
chemical processing
Demulsifiers, drilling and completion fluids,
heat transfer fluids, rheology modifiers, scale
inhibitors, shale inhibitors, specialty amine
solvents, surfactants, water clarifiers, DOW
ADSORBSIA™ selective media, DOW EDI™
modules, DOWEX™ and AMBERJET™ ion
exchange resins, DOWEX™ OPTIPORE™
polymeric adsorbent resins, DOW FILMTEC™
reverse osmosis and nanofiltration elements,
TEQUATIC™ PLUS fine particle filter,
AMBERLYST™ polymeric catalysts,
AQUCAR™, BIOBAN™, SILVADUR™
antimicrobial, DOW POWERHOUSE™ Solar
Shingles
Performance
Monomers
Super absorbents, water treatment, flocculants and
detergents, acrylic sheets, coatings, inks and
paints, molding compounds, impact modifiers,
processing aids, electronic displays, adhesives,
textiles, automotive and architectural safety glass,
and plastics additives
Acrylates, methacrylates, vinyl acetate
monomers, high-quality impact modifiers,
processing aids, foam cell promoters and
weatherable acrylic capstock compounds for
thermoplastic and thermosetting materials
Competition
Competitors of the Infrastructure Solutions segment include many large multinational chemical firms as well as a number of
regional and local competitors. The segment's products have unique performance characteristics that are required by customers
who demand a high level of customer service and expertise from our sales force and scientists; therefore, Dow is well
positioned to withstand competitive threats. Key competitors include Arkema, Ashland, BASF, Elementis, Hydranautics,
Lanxess, Lonza, Owens-Corning and Shin-Etsu Chemical.
Joint Ventures
The Infrastructure Solutions segment includes a portion of the Company's share of the results of Dow Corning, a joint venture
that manufactures silicone and silicone products, which is owned 50 percent by the Company.
On December 10, 2015, the Company entered into a definitive agreement to restructure the ownership of Dow Corning. Under
the terms of the agreement, Dow will become the 100 percent owner of Dow Corning, currently a 50:50 joint venture between
Dow and Corning. Dow and Corning will maintain their current equity stake in the Hemlock Semiconductor Group. The
transaction is expected to close in the first half of 2016.