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113
10.84 Amendment Agreement, dated September 25, 2009, to TECH Facility Agreement dated March 31, 2008,
among TECH Semiconductor Singapore Pte. Ltd. And ABN Amro Bank N.V., Citibank, N.A., Singapore
Branch, Citigroup Global Markets Singapore Pte Ltd, DBS Bank Ltd and Oversea-Chinese Banking
Corporation Limited, as Original Mandated Lead Arrangers (28)
10.85 Supplemental Deed dated September 25, 2009, to Guarantee, dated March 31, 2008, by Micron Technology,
Inc. as Guarantor in favor of ABN Amro Bank N.V., Singapore Branch acting as Security Trustee (28)
10.86 Loan Agreement dated as of November 25, 2009, by and among Micron Semiconductor B.V., Micron
Technology, Inc., and Mai Liao Power Corporation (29)
10.87* Amended and Restated Joint Venture Agreement between Micron Semiconductor, B.V. and Nanya
Technology Corporation dated January 11, 2010 (30)
10.88 Share Purchase Agreement among Micron Technology, Inc., Micron Semiconductor, B.V., Intel Corporation,
Intel Technology Asia Pte Ltd, STMicroelectronics N.V., Redwood Blocker S.a.r.l. and PK Flash, LLC dated
February 9, 2010 (30)
10.89* Framework Agreement among Micron Technology, Inc., STMicroelectronics N.V. and Numonyx B.V. dated
February 9, 2010 (30)
10.90 Stockholder Rights and Restrictions Agreement by and among Micron Technology, Inc., Intel Corporation,
Intel Technology Asia Pte Ltd, STMicroelectronics N.V., Redwood Blocker S.a.r.l. and PK Flash LLC, dated
as of May 7, 2010 (31)
10.91* Second Amended and Restated Technology Transfer and License Agreement between MTI and Nanya
Technology Corp. (NTC) dated July 2, 2010 (32)
10.92* Joint Development Program and Cost Sharing Agreement between MTI and Nanya Technology Corp. (NTC)
dated July 2, 2010 (32)
10.93 Equity Transfer Agreement between Numonyx B.V. and Hynix dated July 29, 2010 (32)
10.94* Guarantee, Charge and Deposit Document between Numonyx B.V. and DBS Bank Ltd. dated August 31,
2010 (32)
10.99 Numonyx Holdings B.V. Equity Incentive Plan (33)
10.100 Numonyx Holdings B.V. Equity Incentive Plan Forms of Agreement (33)
10.101 Purchase Agreement dated July 20, 2011, between Micron Technology, Inc. and Morgan Stanley & Co. LLC,
as representative of the initial purchasers (12)
10.102 Form of Capped Call Confirmation dated as of July 20, 2011, between the Company and Société Genérale
(34)
10.103 Form of Capped Call Confirmation dated as of July 22, 2011 (34)
10.104* 2012 Master Agreement by and among Intel Corporation, Intel Technology Asia PTE LTD, Micron
Technology, Inc., Micron Semiconductor Asia PTE LTD, IM Flash Technologies, LLC and IM Flash
Singapore, LLP dated February 27, 2012 (35)
10.105* IMFS Business Sale Agreement by and among Intel Technology Asia PTE LTD, Micron Semiconductor Asia
PTE LTD and IM Flash Singapore, LLP dated February 27, 2012 (35)
10.107* MTV Asset Purchase and Sale Agreement dated April 6, 2012, among Micron Technology, Inc., Intel
Corporation and IM Flash Technologies, LLC (36)
10.108* Second Amended and Restated Limited Liability Company Operating Agreement of IM Flash Technologies,
LLC dated April 6, 2012, between Micron Technology, Inc. and Intel Corporation (37)
10.109* Amendment to the Master Agreement dated April 6, 2012, between Intel Corporation and Micron
Technology, Inc. (37)
10.110* Amended and Restated Supply Agreement dated April 6, 2012, between Intel Corporation and IM Flash
Technologies, LLC (37)
10.111* Amended and Restated Supply Agreement dated April 6, 2012, between Micron Technology, Inc. and IM
Flash Technologies, LLC (37)
10.112* Product Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and
Micron Semiconductor Asia PTE LTD (37)
10.113* Wafer Supply Agreement dated April 6, 2012, among Micron Technology, Inc., Intel Corporation and Micron
Singapore (37)
10.114* Deposit Agreement dated April 6, 2012, between Micron Technology, Inc. and Intel Corporation (37)
10.115 First Amendment to the Limited Liability Partnership Agreement dated April 6, 2012, between Micron
Semiconductor Asia PTE LTD and Intel Technology PTE LTD (37)
10.116 Form of Capped Call Confirmation (1)