AMD 1995 Annual Report Download - page 126

AMD and Intel Confidential
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] functions substantially with
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
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with an [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
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configured to [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH
THE SECURITIES AND EXCHANGE COMMISSION] configured to [CONFIDENTIAL
INFORMATION OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE
COMMISSION] or [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY
WITH THE SECURITIES AND EXCHANGE COMMISSION] shall not be deemed to be
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] unless such [CONFIDENTIAL INFORMATION
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has a [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] substantially compatible with an
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] or a [CONFIDENTIAL INFORMATION
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The [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] for the [CONFIDENTIAL INFORMATION
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as originally introduced, constitutes an example of a [CONFIDENTIAL
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COMMISSION] that is not compatible with the [CONFIDENTIAL INFORMATION
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of the [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
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1.10 [CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] shall mean a circuit that
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] a [CONFIDENTIAL INFORMATION OMITTED
AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION] and a
[CONFIDENTIAL INFORMATION OMITTED AND FILED SEPARATELY WITH THE
SECURITIES AND EXCHANGE COMMISSION] for connection with [CONFIDENTIAL
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COMMISSION]
1.11 "Semiconductor Material" shall mean any material whose conductivity is
intermediate to that of metals and insulators at room temperature and
whose conductivity, over some temperature range, increases with increases
in temperature. Such materials shall include, but not be limited to,
refined products, reaction products, reduced products, mixtures and
compounds.
1.12 "Semiconductor Device" shall mean a device and any material therefor,
comprising a body of one or more Semiconductor Materials and one or more
electrodes associated therewith, and, if provided therewith, housing
and/or supporting means therefore.
1.13 "Integrated Circuit" shall mean an integral unit comprising a plurality
of active and/or passive circuit elements associated on one or more
substrates, such unit forming, or contributing to the formation of, a
circuit for performing electrical functions and, if provided therewith,
housing and/or supporting means therefor.
1.14 "Circuit Assembly" shall mean (a) a circuit or a circuit system,
including hardware and/or software, in which one or more Semiconductor
Devices and/or one or more Integrated Circuits are interconnected in one
or more paths (including passive circuit elements, if any), for
performing electrical functions, and (/b) a combination of such circuits
or circuit systems and (c) if provided therewith, I/O devices or housing
and/or supporting means therefor.
1.15 "AMD Patents" shall mean all classes or types of patents, utility models
and design patents (including, without limitation, originals or
divisions, continuations, continuations-in-part or reissues), and
applications for these classes or types of all countries of the world
owned or controlled by AMD or its Subsidiaries at any time during the
term of this Agreement which (a) have a first effective filing date prior
to the expiration or termination of this Agreement and (b) except for
consideration paid to employees, have no requirement to pay consideration
to another for the grant of a license under this Agreement.
1.16 "INTEL Patents" shall mean all classes or types of patents, utility
models and design patents (including, without limitation, originals or
divisions, continuations, continuations-
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Source: ADVANCED MICRO DEVIC, 10-K405, March 21, 1996