Oki 2004 Annual Report Download - page 10

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Oki has adopted a “fab-free” approach to its LSI
business. In line with this concept, it signed
comprehensive partnership agreement with United
Microelectronics Corporation (UMC) of Taiwan in 2002.
The relationship includes the contracting of advanced
fabrication processes at the 0.15µm level and below.
In China, Oki supplies technology to Shanghai’s Grace
Semiconductor Manufacturing Corporation Ltd.
(GSMC) and is actively building a partnership to meet
demand in the expanding Chinese market.
μPLAT®
W-CSP
SOI
SOS
Digital appliances
Power consumption
reduction technology
High-density
packaging technology
Process technology IP/
system technology
Compact/high-voltage resistant, low power consumption,
high performance RF, software and services, high sound quality,
short turn around times, large capacity/high-speed capacity,
high quality
In-vehicle equipment
Mobile telephones Telecommunications
and network equipment
Information
appliances
Unique products
Customer value
Personal and mobile markets
Key advanced technologies
A hardware/software integration
platform for system LSI
development
Leading the industry, in 1998 Oki
developed µPLAT®, a hardware and
software integration platform based on
a central processing unit (CPU) from
ARM Ltd. in the UK. Since then Oki has
helped manufacturers to reduce system
LSI development times by supplying
the industry’s most advanced
development platforms. µPLAT is used
for system LSI development in a wide
range of equipment, including
automotive engine controllers, mobile
telephones, PC peripherals, and
network equipment.
Core technologies
Wireless LSIs P2ROMTMs
Sound generator
LSIs
PHS base band LSIs
LCD drivers
VoIP LSIs
μPLAT®
LSIs with extremely low power
consumption
Oki led the world in the mass-
production of fully depleted silicon-on-
insulator (SOI) LSIs with extremely low
power consumption. The technology is
used in radio signal receiver ICs for
watches and in µPLAT products. In
2002 Oki established a partnership with
Peregrine Semiconductor Corp. of the
United States, the leader in advanced
silicon-on-sapphire (SOS) technology.
This technology brings even greater
reductions in power consumption in
system LSIs used in radio frequency
(RF) switches, global positioning
system (GPS) receivers, TV tuners and
other products.
SOI and SOS
The world’s most compact
packaging technology
Wafer-level chip size package (W-CSP)
technology is used to package
semiconductors in wafer form. It is the
world’s most compact packaging
technology for devices used in mobile
telephones, personal digital assistants
(PDAs) and other compact, high-
performance mobile products. Oki is
also developing a packaging foundry
service.
W-CSP
Developing Unique LSIs
Features
Partner fabricators
In house fabrication
Miyagi Oki
UMC GSMC
Oki ThailandMiyazaki Oki
Partners’ facilities
10 ANNUAL REPORT 2004