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Exhibit Description of Exhibits
**10.48 Wafer Supply Agreement Amendment No. 1, among Advanced Micro Devices, Inc.,
GLOBALFOUNDRIES Inc., GLOBALFOUNDRIES U.S. Inc. and GLOBALFOUNDRIES
Singapore. Pte. Ltd., dated March 29, 2011, filed as Exhibit 10.1 to AMD’s Quarterly Report on
Form 10-Q/A for the period ended April 2, 2011, is hereby incorporated by reference.
**10.49 Wafer Supply Agreement Amendment No. 2, among Advanced Micro Devices, Inc.,
GLOBALFOUNDRIES Inc., GLOBALFOUNDRIES U.S. Inc., Advanced Technology Investment
Company LLC and ATIC International Investment Company LLC, dated March 4, 2012, filed as
Exhibit 10.1 to AMD’s Quarterly Report on Form 10-Q for the period ended March 31, 2012, is
hereby incorporated by reference.
**10.50 Wafer Supply Agreement Amendment No. 3, among Advanced Micro Devices, Inc.,
GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated December 6, 2012, filed
as Exhibit 10.34(c) to AMD’s Annual Report on Form 10-K for the period ended December 29,
2012, is hereby incorporated by reference.
10.51 Settlement Agreement, between Advanced Micro Devices, Inc. and Intel Corporation, dated
November 17, 2009, filed as Exhibit 10.1 to AMD’s Current Report on Form 8-K dated
November 17, 2009, is hereby incorporated by reference.
**10.52 Patent Cross License Agreement, between Advanced Micro Devices, Inc. and Intel Corporation
filed, dated November 11, 2009, as Exhibit 10.2 to AMD’s Current Report on Form 8-K dated
November 17, 2009, is hereby incorporated by reference.
10.53 Loan and Security Agreement, among Advanced Micro Devices, Inc., AMD International Sales &
Service, Ltd., the financial institutions party thereto from time to time as lenders and Bank of
America, N.A., dated November 12, 2013, filed as Exhibit 1.01 to AMD’s Current Report on Form
8-K dated November 12, 2013, is hereby incorporated by reference.
10.54 Lease Agreement, between AMD and Delaware Chip LLC, dated December 22, 1998, filed as
Exhibit 10.27 to AMD’s Annual Report on Form 10-K for the fiscal year ended December 27,
1998, is hereby incorporated by reference.
10.55 Agreement of Purchase and Sale, between Advanced Micro Devices, Inc. and 7171 Southwest
Parkway Holdings, LP, effective March 11, 2013, filed as Exhibit 10.1 to AMD’s Quarterly Report
on Form 10-Q for the period ended March 30, 2013, is hereby incorporated by reference.
10.56 Sublease Agreement, between Lantana HP, LTD and Advanced Micro Devices, Inc., dated
March 26, 2013, filed as Exhibit 10.2 to AMD’s Quarterly Report on Form 10-Q for the period
ended March 30, 2013, is hereby incorporated by reference.
10.57 Master Landlord’s Consent to Sublease, between 7171 Southwest Parkway Holdings, L.P.,
Lantana HP, Ltd. and Advanced Micro Devices, Inc., dated March 26, 2013, filed as Exhibit 10.3
to AMD’s Quarterly Report on Form 10-Q for the period ended March 30, 2013, is hereby
incorporated by reference.
10.58 Lease Agreement, between 7171 Southwest Parkway Holdings, L.P. and Lantana HP, Ltd., dated
March 26, 2013, filed as Exhibit 10.4 to AMD’s Quarterly Report on Form 10-Q for the period
ended March 30, 2013, is hereby incorporated by reference.
**10.59 Wafer Supply Agreement Amendment No. 4, among Advanced Micro Devices, Inc.,
GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated March 30, 2014, field as
Exhibit 10.1 to AMD’s Quarterly Report on Form 10-Q/A for the period ended March 29, 2014, is
hereby incorporated by reference.
*10.60 Transition, Separation Agreement and Release by and between Rory P. Read and Advanced Micro
Devices, Inc. effective October 8, 2014, filed as Exhibit 10.1 to AMD’s Current Report on
Form 8-K/A dated October 14, 2014, is hereby incorporated by reference.
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