3Ware 2002 Annual Report Download - page 11

for the various cost, power and performance trade-offs faced by our customers. We believe that our systems
knowledge also enables us to develop more comprehensive, interoperable solutions. This allows us to develop
boards with products that fulfill customers’ system needs from fiber-through-switch, enabling faster integration
into their products.
Design of Communications ICs
We have developed multiple generations of products that integrate both analog and digital elements on the
same IC, while balancing the difficult trade-offs of speed, power and timing inherent in high-speed applications.
We were one of the first companies to embed analog phase locked loops in bipolar chips with digital logic for
high-speed data transmission and receiver applications. Since the introduction of our first on-chip clock recovery
and clock synthesis products in 1993, we have refined these products and have successfully integrated multiple
analog functions and multiple channels on the same IC. The mixing of digital and analog signals poses difficult
challenges for IC designers, particularly at high frequencies. We have acquired significant expertise in mixed-
signal IC designs through the development of multiple generations of products. Through the acquisitions of
MMC Networks and YuniNetworks in fiscal 2001, we added network processor and switch fabric digital design
and systems expertise. We will continue to apply these competencies in the development of more complex digital
products.
Manufacturing of Communications ICs
The manufacturing of communications ICs requires a combination of competencies in advanced silicon
technologies, such as deep submicron CMOS and BiCMOS silicon germanium (“SiGe”), IC package design and
manufacturing, and high speed test and characterization. We have obtained access to advanced CMOS and SiGe
processes through foundry relationships. We have substantial experience in the development and use of plastic
and ceramic packages for high-performance applications. The selection of the optimal package solution is a vital
element of the delivery of high-performance products and involves balancing cost, size, thermal management and
technical performance. Our products are designed to reduce power dissipation and die size to enable the use of
industry standard packages. We employ a wide variety of package types and are currently designing products
using ball grid arrays, tape ball grid arrays and multi-chip modules. Our experience with a variety of packages is
one of the factors that enables us to provide optimal high-performance IC solutions to our customers.
Research and Development
Our research and development expertise and efforts are focused on the development of high-performance
analog, digital and mixed-signal ASSPs for WAN applications. We also develop high-performance libraries and
design methodologies that are optimized for these applications.
Product Development
Our product development is focused on building high-performance high-gate-count digital and analog-
intensive designs that are incorporated into well-documented blocks that can be reused for multiple products. We
have made, and will continue to make, significant investments in advanced design tools to leverage our
engineering staff. Our product development is driven by the imperatives of reducing design cycle time,
increasing first-time design correctness, adhering to disciplined, well documented design processes and
continuing to be responsive to customer needs. We are also developing high-performance packages for our
products in collaboration with our packaging suppliers and our customers.
Process Development
Our process development is focused on identifying or acquiring new processes optimized for high-
performance digital and mixed-signal communications applications. Our process engineers are involved with the
selection and management of our relationships with outside foundries to provide the advanced CMOS, SiGe and
other leading edge process technologies required for certain of our products.
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