Qualcomm 1999 Annual Report Download - page 33

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29
03.25.99
CDMA Agreement With Ericsson
Ericsson and QUALCOMM agree to
jointly support a single CDMA world
standard with three optional modes
for the next generation of wireless
communications, to enter into
royalty-bearing cross licenses for
their respective patent portfolios
and to settle the existing litigation
between the companies. As part of
the agreement, Ericsson purchased
our terrestrial CDMA wireless infra-
structure business, including its R&D
resources, located in San Diego,
California and Boulder, Colorado.
04.09.99
FORTUNE 500 List
FORTUNE magazine names QUALCOMM
to its 1999 FORTUNE 500® list, which
highlights the largest companies
in America.
04.14.99
Stock Split
The Board declares a 2-for-1 stock
split of the Company’s Common
Stock distributed (on May 10) to
stockholders of record on April 21.
04.19.99
Japan’s First CDMA Network
QUALCOMM’s 5th generation MSM3000
chipsets are featured in the phones
developed by three Japanese manu-
facturers for the country’s first
nationwide cdmaOne network.
02.08.99
15,000 Truckers Get CabCARD®
The nation’s largest trucking firm,
Schneider, contracts for CabCARD
e-mail and pre-paid phone services.
6th Generation Chips
The 6th generation MSM3100™
chipset and system software solu-
tion features a 50 percent reduction
in chip size and up to 300 hours of
standby time. The first baseband
modem to offer on-chip hardware
support for in-phone GPS-based
CDMA position and location ser-
vices, it enables manufacturers to
meet the FCC mandate for emer-
gency location tracking (E911).
Advanced Voice Recognition
An add-on option for the
MSM3000/3100 system software,
PureVoice VR™ voice recognition
software allows manufacturers to
quickly add powerful speech capa-
bilities to CDMA handsets without
additional hardware.
03.15.99
$14M Mobile Development
Agreement
QUALCOMM and Symbol Tech-
nologies, Inc. will develop mobile
vehicle computer and integrated
technology solutions for the trans-
portation industry.
03.17.99
10 Millionth Phone Shipped
QUALCOMM Personal Electronics
(QPE), a joint venture between
subsidiaries of QUALCOMM and
Sony Electronics Inc., ships its
ten millionth CDMA phone.
01.25.99
New “Thin Phone”
The QUALCOMM Thin Phone (the 4th
generation of CDMA digital wireless
phones) features an ultra-thin design
and weighs only four ounces.
01.26.99
Cheaper E-mail For Truckers
QUALCOMM reduces prices dramati-
cally on CabCARD®
, providing e-mail
savings to over 85,000 truck drivers.
01.27.99
30 Million MSMs
Mobile Station Modem chip ship-
ments pass the 30 million mark.
5th Generation Chips
Production shipping begins for the
5th generation CDMA chipset and
system software. Twenty-one leading
CDMA handset manufacturers agree
to purchase the MSM3000 chipset
and system software.
02.01.99
New Chip Packaging
New packaging debuts for the
MSM3000 and IFT3000™ and
IFR3000™fully integrated Inter-
mediate Frequency (IF) chipsets.
Manufacturers can design smaller
handsets with longer stand-by times
and higher data-rate services. It is
the first single-chip baseband solu-
tion to enable data speeds up to 86.4
kbps. Handheld wireless devices
using the chipset will be faster than
personal computers equipped with
standard modems.