Epson 2010 Annual Report Download - page 29

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28
approximately five meters.
Other businesses and company-wide
Our researchers established technology for depositing uniform layers using an inkjet process. The process
exploits Epson’s proprietary Micro Piezo inkjet technology to achieve markedly greater accuracy in organic
material deposition than the conventional technology. Extremely uniform layers (weight error < 1%) are
achieved by precisely controlling the selection and ejection of multi-size droplets of ink material on a substrate
so that only the required volume of material is deposited. This technology offers dramatically improved quality
and throughput and helped push the advent of large-screen organic light-emitting diode (OLED) TVs a
significant step closer to realization.
GL bonding technology was developed to achieve optical components that provide uniform wavefront aberration
characteristics. Instead of adhesives made of relatively thick layers of organic material, GL bonding technology
uses inorganic glass materials in an ultra-thin film (as thin as 100 nm) to bond together quartz substrates that
exhibit high photostability and reduced transmitted wavefront aberrations. Wave plates employing GL bonding
technology show no signs of physical changes, transmitted wavefront aberrations, or heat damage even after
being exposed for more than 1,000 hours to blue wavelength light irradiation at a power density on the order of
1 W/mm2.